1. Three dimensional printed electronic devices realised by selective laser melting of copper/high-density-polyethylene powder mixtures
- Author
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Siyuan Qi, David A. Hutt, Mulan Mu, John R. Tyrer, Zuoxin Zhou, and Shuai Hou
- Subjects
Materials science ,Metals and Alloys ,chemistry.chemical_element ,02 engineering and technology ,Substrate (electronics) ,Polyethylene ,010402 general chemistry ,021001 nanoscience & nanotechnology ,01 natural sciences ,Copper ,Industrial and Manufacturing Engineering ,0104 chemical sciences ,Computer Science Applications ,chemistry.chemical_compound ,Surface-area-to-volume ratio ,chemistry ,Electrical resistivity and conductivity ,Modeling and Simulation ,Ceramics and Composites ,High-density polyethylene ,Selective laser melting ,Composite material ,0210 nano-technology ,Electrical conductor - Abstract
A manufacturing process with the capability to integrate electronics into 3D structures is of great importance to the development of next-generation miniaturised devices. In this study, Selective Laser Melting (SLM) was used to process copper/high-density-polyethylene (HDPE) powder mixtures to build conductive tracks in a 3D circuit system. The effects of copper/HDPE volume ratio, laser input power and scanning speed on the resistivity of CO2 laser processed tracks were investigated. The resistivity of the tracks decreased from 26.6 ± 0.6 × 10−4 Ωcm to 1.9 ± 0.1 × 10−4 Ωcm as the copper volume ratio increased from 30% to 60%. However, further increasing the copper ratio to 100% resulted in poor conductivity. The lowest resistivity was achieved with an input power of 20 W and scanning speed of 80 mm/s. Additionally, processing using single-track-scanning and raster-scanning programs was compared; the overall energy distribution on the surface was more uniform using a raster-scanning program, which further reduced the resistivity to 0.35 ± 0.04 × 10−4 Ωcm. Based on the results, a 3D multi-layered circuit system was manufactured with the HDPE as the substrate/matrix material and copper/HDPE mixture as the conductive-track material. This circuit system was successfully manufactured, demonstrating the possibility of using SLM technology to manufacture dissimilar materials towards 3D electronic applications.
- Published
- 2018