1. Polymer composites with enhanced thermal conductivity via oriented boron nitride and alumina hybrid fillers assisted by 3-D printing
- Author
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Baohua Li, Jia Li, Feiyu Kang, Mengjing Liu, Sun-Wai Chiang, Lin Gan, Chu Xiaodong, Yan-Bing He, and Hongda Du
- Subjects
010302 applied physics ,Filler (packaging) ,Materials science ,Polydimethylsiloxane ,Process Chemistry and Technology ,3 d printing ,02 engineering and technology ,021001 nanoscience & nanotechnology ,01 natural sciences ,Surfaces, Coatings and Films ,Electronic, Optical and Magnetic Materials ,chemistry.chemical_compound ,Thermal conductivity ,chemistry ,Boron nitride ,0103 physical sciences ,Thermal ,Heat transfer ,Materials Chemistry ,Ceramics and Composites ,Polymer composites ,Composite material ,0210 nano-technology - Abstract
Herein, oriented boron nitride (BN)/alumina (Al2O3)/polydimethylsiloxane (PDMS) composites were obtained by filler orientation due to the shear-inducing effect via 3-D printing. The oriented BN platelets acted as a rapid highway for heat transfer in the matrix and resulted in a significant increase in the thermal conductivity along the orientation direction. Extra addition of spherical Al2O3 enhanced the fillers networks and resulted in the dramatic growth of slurry viscosity. This, together with filler orientation induced the synergism and provided large increases in the thermal conductivity. A high orientation degree of 90.65% and in-plane thermal conductivity of 3.64 W/(m∙K) were realized in the composites with oriented 35 wt% BN and 30 wt% Al2O3 hybrid fillers. We attributed the influence of filler orientation and hybrid fillers on the thermal conductivity to the decrease of thermal interface resistance of composites and proposed possible theoretical models for the thermal conductivity enhancement mechanisms.
- Published
- 2020
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