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Metallic films, which are thin layers of metal deposited on surfaces, have a wide range of uses in many sectors. Metallic films are usually produced by sputtering or chemical vapor deposition and serve an important role in electronics, optics and coatings. Their fundamental conductivity, reflective qualities and adaptability makes important for the development of innovative materials and systems. Investigations are conducted on the rigidity, optical reflecting power, temperature conductivity and power mobility of metallic films. These attributes are affected by layer thickness, composition and deposition processes. Understanding the complexities of these physical features is critical for modifying metallic films to particular applications, which drives technological and material science innovation. In this research, the physical characteristics of metallic films, which are thinner than 20 – 200 nm were evaluated. The suggested methods for determining the Cu, and Al films temperature-dependent coefficients of resistance, thermal conductivity properties, particular heat and thermal diffusivity. The rapid amount of heating that is observed in a brief period allows the thermal characteristics of the metallic layer to be primarily evaluated without impacting the substrate. [ABSTRACT FROM AUTHOR]