42 results on '"reflow"'
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2. An intelligent system for reflow oven temperature settings based on hybrid physics-machine learning model
3. Effect of different thermocouple constructions on heat-level vapour phase soldering profiles
4. Real-time profiling of reflow process in VPS chamber
5. Effects of reflow on the interfacial characteristics between Zn nanoparticles containing Sn‐3.8Ag‐0.7Cu solder and copper substrate
6. Oxidation and Au‐Sn reaction of laser reflowed micro‐solder joints protected by N2 or exposed to air atmosphere
7. Finite element analysis of flip – chip on board (FCOB) assembly during reflow soldering process
8. Modeling of plated through hole reliability and performance
9. Interaction kinetics between PBGA solder balls and Au/Ni/Cu metallisation during laser reflow bumping
10. Reducing bonding cycle time of adhesive flip chip process
11. Evaluation of two novel lead‐free surface finishes
12. Effect of reflow profile on wetting and intermetallic formation between Sn/Ag/Cu solder components and printed circuit boards
13. Intermetallic morphology around Ni particles in Sn‐3.5Ag solder
14. CFD modelling of the flow field inside a reflow oven
15. A simplified model of the reflow soldering process
16. Using computer models to identify optimal conditions for flip‐chip assembly and reliability
17. Lead‐free reflow soldering for electronics assembly
18. Microstructural characterisation of reflowed and isothermally‐aged Cu and Ag particulate reinforced Sn‐3.5Ag composite solders
19. Stencil design for mixed technology through‐hole/SMT placement and reflow
20. Optimizing the reflow profile via defect mechanism analysis
21. Finite element modelling of printed circuit boards (PCBs) for structural analysis
22. Verification of flip‐chip assembly on FR4 boards
23. In situ temperature measurements of PQFPs during infrared reflow
24. Heated Gas Jet Reflow: An Alternative Reflow Solder Assembly Process Technology*
25. Popcorning in Fully Populated and Perimeter Plastic Ball Grid Array Packages*
26. McDry prevents micro-cracking in ICs
27. Small reflow oven for lead-free SMT
28. Reflow Soldering Processes and Troubleshooting SMT, BGA, CSP and Flip Chip Technologies
29. Reflow Soldering Processes and Troubleshooting: SMT, BGA, CSP and Flip Chip Technologies
30. Pin-in-hole reflow specialist proves fit-for-purpose stencils
31. Void free soldering – inline reflow and vacuum furnace
32. Insight software for reflow tracker
33. BTUS new Pyramax reflow systems lowers cost of ownership
34. IC-SCAN DE tracks MSDs for double side reflow boards
35. Vitronics Soltec and ECD announce new SMT profiling technology advance for reflow soldering systems
36. User-friendly AOI system for pre-reflow inspection
37. Temperature profiling just got easier
38. Radiant technology unveils new wafer bump reflow oven
39. Powerful
40. New reflow ovens provide improved operating process and low maintenance
41. Speedline ACCEL's new MicroPro™ integrates the reflow and cleaning process
42. Multicore takes the guesswork out of reflow soldering
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