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Ultrasonic is one important factor of ultrasonic wire bonding process, which is widely used in semiconductor packaging industry. Control effect of ultrasonic power determines the quality and speed of wire bonding. Based on analysis of ultrasonic frequency characteristics and current response, this paper proposes a closed-loop control method of automatic frequency tracking and output current control, to improve the effectiveness of ultrasonic power, shorten the response time, and enhance the stability of ultrasonic generation. Automatic frequency tracking is based on phase lock method. Phase difference of voltage and current signals works as the feedback of the close-loop control of frequency to realize automatic frequency tracking and ensure that the ultrasonic transducer always works at resonance point. And output current control is working at constant current mode so that the vibration amplitude of ultrasonic can be better controlled by adjusting the ultrasonic current. The experimental results show that with the frequency automatic tracking method, the ultrasonic transducer system can achieve wider frequency bands, with faster phase locking and higher tracking precision. With close loop control, real-time tracking can be realized and less rise time and less overshoot of ultrasonic current can be achieved.

Motion related bonding accuracy study is needed to build up the correlation between motion tracking performance and bonding accuracy. Based on links between bonding specifications and motion performance, grading can be given to motion performance to represent acceptable bonding accuracy. A diagnostic tool is developed to check motion performance periodically and fine tune motion performance to healthy condition in case motion performance is not good or healthy enough for accurate bonding. An intelligent approach is promoted in this paper to fine tune parameters to satisfy multiple targets of dynamic and settling performance requirements. This intelligent fine tuning approach, with achievable multiple motion targets, provides a solution to optimize motion system performance on bonding machines, so as to further improve bonding performance. The idea proposed in this paper helps on development and smooth mass production of semiconductor packaging equipment.

It’s always difficult to satisfy both strict requirements of dynamic performance and settling performance of high-precision and high-acceleration point-to-point motions on electronic packaging equipment, i.e., Die bonders, Wire bonders, Flip-chip bonders, Wafer bumping machines, and so on. Focusing on this difficulty, Fuzzy logic is promoted in this paper to fine tune feed forward coefficient parameters of motion systems on packaging equipment to satisfy multiple targets of dynamic and settling performance requirements. This intelligent fine tuning approach, with achievable multiple motion targets, provides a therapy to automate and optimize motion system performance on packaging equipment, help on development and mass production of semiconductor packaging equipment, and improve machine intelligence.