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Aiming at solving the problems of complex image background and difficulties in the later image segmentation, an image segmentation algorithm based on the chaotic particle swarm algorithm and fuzzy clustering is proposed. First, the color space is converted from the RGB color space into the HIS color space. Then, a hybrid algorithm consisted of chaotic particle swarm optimization and fuzzy clustering is introduced. Each color component is processed by the algorithm, and the corresponding partition graph is obtained. Finally, the color space is converted into the RGB color space to achieve the segmentation effect. Experimental results show that the new algorithm has higher accuracy to segment the image and has good robustness to noises.

In this paper, we present a new technique that could realize wafer level 3-D hermetic package in a very low bonding temperature (120°C) for MEMS (Micro-electro-mechanical Systems) devices. Microcavities were etched on a host glass wafer and were bonded with a carrier silicon wafer. MicroChem SU-8 photoresist is used as the intermediate adhesive layer between the host and carrier wafer. The devices were fabricated by self-aligning etching technique and were finally sealed by coating the structures with sputtered aluminum. Helium leak testing is carried out to verify the hermetic characteristics of the package, 99.7% of the tested devices were qualified. This technology shows a significant improvement of the hermeticity properties of adhesive bonded cavities, making it particularly suitable for applications on gas-tightness with low temperature, non-aggressive demands.Copyright © 2007 by ASME