1. Phase‐Change‐Memory Process at the Limit: A Proposal for Utilizing Monolayer Sb2Te3
- Author
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Xian-Bin Li, Shengbai Zhang, Bin Chen, Xue-Peng Wang, Nian-Ke Chen, and Feng Rao
- Subjects
Materials science ,Recrystallization (geology) ,General Chemical Engineering ,high‐density data storage ,Science ,General Physics and Astronomy ,Medicine (miscellaneous) ,Biochemistry, Genetics and Molecular Biology (miscellaneous) ,Phase (matter) ,Monolayer ,General Materials Science ,Scaling ,Full Paper ,business.industry ,2D limit ,General Engineering ,Hexagonal phase ,first‐principles molecular dynamics ,Full Papers ,Amorphous solid ,Phase-change memory ,phase change memory ,Computer data storage ,Optoelectronics ,business ,Sb2Te3 - Abstract
One central task of developing nonvolatile phase change memory (PCM) is to improve its scalability for high‐density data integration. In this work, by first‐principles molecular dynamics, to date the thinnest PCM material possible (0.8 nm), namely, a monolayer Sb2Te3, is proposed. Importantly, its SET (crystallization) process is a fast one‐step transition from amorphous to hexagonal phase without the usual intermediate cubic phase. An increased spatial localization of electrons due to geometrical confinement is found to be beneficial for keeping the data nonvolatile in the amorphous phase at the 2D limit. The substrate and superstrate can be utilized to control the phase change behavior: e.g., with passivated SiO2 (001) surfaces or hexagonal Boron Nitride, the monolayer Sb2Te3 can reach SET recrystallization in 0.54 ns or even as fast as 0.12 ns, but with unpassivated SiO2 (001), this would not be possible. Besides, working with small volume PCM materials is also a natural way to lower power consumption. Therefore, the proposed PCM working process at the 2D limit will be an important potential strategy of scaling the current PCM materials for ultrahigh‐density data storage., By first‐principles molecular dynamics, this work proposes a phase change memory (PCM) process at the 2D limit that is achieved in a monolayer Sb2Te3 for the first time. This will be a potential strategy for improving the performance of PCM technology to realize high integrated density, fast speed, low power consumption, or even artificial intelligence applications.
- Published
- 2021