1. Automatic Optical Inspection of Bump Offsets in Flex-on-Glass Bonding Using Differential Interference Contrast Imaging
- Author
-
Ni Guangming, Juanxiu Liu, Yong Liu, Jing Zhang, Huimin Yue, Xiangzhou Wang, Lin Liu, and Du Xiaohui
- Subjects
0209 industrial biotechnology ,Liquid-crystal display ,Materials science ,Offset (computer science) ,business.industry ,Mechanical Engineering ,02 engineering and technology ,Industrial and Manufacturing Engineering ,law.invention ,020303 mechanical engineering & transports ,020901 industrial engineering & automation ,Optics ,0203 mechanical engineering ,Differential interference contrast microscopy ,law ,Poisson point process ,FLEX ,Electrical and Electronic Engineering ,Detection rate ,business - Abstract
Bump offsets have harmful effects on the quality of flex-on-glass (FOG) bonding in liquid crystal display (LCD) module industry. Here we report a novel automatic optical inspection (AOI) method to achieve fast inspecting FOG bonding bump offsets. Overcoming difficulties to image targets at different depths in light absorption medium when using ultra-short-exposure and high-speed imaging, the proposed method innovatively achieves inspecting FOG bonding bump offsets using differential interference contrast imaging based on spatial Poisson point process approximation. Theoretical analysis proves that the proposed method has high reliability in FOG bonding bump offset AOI inspection. Experimental results show missed detection rate of the inspection algorithm is 0.01%, and false rate is 0.1%, and verify the accuracy and validity of the proposed method, all of which are significant for guiding practice in LCD module industry.
- Published
- 2019