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1. Versatile multilayer MCM-D structure for high reliability applications

Author

Strandberg, Jan, Thiede, Heike, Karlsson, Anita, Bodo, Peter, Haglund, Joacim, Valizadeh, Sima, and Weiland, Anders

Subjects
Electronic packaging -- Research, Thin films, Multilayered -- Research, Dielectrics -- Research, Business, Engineering and manufacturing industries, Science and technology
Abstract

Finite Element Analysis and Scanning Electron Microscopy were conducted to determine the versatility of multilayer multichip module-D (MCM-D) for high reliability applications. The evaluation also aimed to identify the mechanical stresses caused by thermal cracking and shock. Results reveal that these mechanical stresses can be prevented by careful stress control during processing, improvement of adhesion between layers and optimization of the design rules.

Published
1997

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