1. Effects of Pd Surface Coating on the Strength and Fracture Behavior of Cu Micro Bonding Wires
- Author
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Jian Lu, Ke Cao, H.K. Yang, and Yang Lu
- Subjects
010302 applied physics ,Wire bonding ,Structural material ,Materials science ,business.industry ,Lüders band ,Metallurgy ,0211 other engineering and technologies ,Metals and Alloys ,02 engineering and technology ,engineering.material ,Condensed Matter Physics ,01 natural sciences ,Surface coating ,Coating ,Mechanics of Materials ,0103 physical sciences ,engineering ,Microelectronics ,Dislocation ,business ,Layer (electronics) ,021102 mining & metallurgy - Abstract
Because of their high strength and oxidation resistance as well as low cost, Cu micro bonding wires have received increased interests in microelectronic packaging industry. The present work revealed that the coating boundary provided additional strength improvement by blocking dislocation gliding. Furthermore, the greater strain concentration along slip bands introduced larger cracks within the Pd coating layer with coarser grains. The present study provides insights for reliable Pd-coated Cu micro bonding wire processing and bonding applications.
- Published
- 2019
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