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A Cu-Sn-Ti-based active brazing filler alloy was in situ reinforced with nanosized TiC particles by adding different amounts of a cellulose nitride-based binder. The TiC particles emanate from a reaction of the Ti within the filler alloy with the carbon from the binder that does not decompose completely during heating. The correlation between the microstructure and mechanical performance was studied. In addition, the effect of different binder amounts on the shear strength and cutting performance of brazed diamond grains was studied in shear tests and single grain cutting tests. The results clearly show that the mechanical performance of the brazed diamond grains can be improved by the formation of TiC particles. This is attributed to particle strengthening of the filler alloy matrix as well as to the decreasing grain size and more homogeneous distribution of the (Cu,Sn)3Ti5 phase with increasing amount of binder.

Active brazing is an effective technique for joining diamond or cBN grit to metallic substrates. This technique is currently used to manufacture superabrasive, high-performance tools. The investigation of interface reactions between diamond and active brazing alloys plays an important role in understanding and improving the brazing process and the resultant tool performance. Focused ion beam (FIB) milling enabled the high resolution investigation of these extremely difficult to prepare metal–diamond joints. The interfacial nanostructure is characterized by the formation of two layers of TiC with different morphologies. First a cuboidal layer forms directly on the diamond and reaches a thickness of approximately 70 nm. Then a second layer with columnar TiC crystals grows on the first layer into the brazing filler metal by a diffusion-controlled process. The combined thickness of both TiC layers varies between 50 nm and 600 nm depending on the brazing temperature and holding time.

The commercial active brazing alloy “Incusil-ABA” was used for the bonding of diamond grits in order to assess their suitability for high performance machining tools. It was found that the microstructure of the brazing alloy matrix consisted of primary precipitates of Cu in a Ag–Cu eutectic matrix and an additional Cu–In–Ti rich intermetallic phase. Interface characterisation revealed the presence of a Ti-rich interfacial layer between the diamond and the alloy matrix. Therefore, good wettability was obtained for the embedded diamond grit particles. This intervening layer comprised nanosized cuboidal TiC which seemed to have acted as a precursor to its formation and fine metastable needles that were identified as cubic Ti3InC. Furthermore it was demonstrated that a three phase crystallographic orientation relationship had been obeyed at the interfacial region between the diamond, TiC and Ti3InC.

Melting experiments of Cu-Sn-Ti-Zr filler metal powder containing cellulose nitrate and graphite, respectively, resulted in the formation of nanosized TiC particles in both Cu-rich phase and CuSn 3 Ti 5 intermetallic regions of the alloy (see figure). The variation of the binder type and content allows to tailor the properties of the filler metals in terms of erosion resistance, decisive for a new generation of superabrasive tools.

The joining of macroscopic films of vertically aligned multiwalled carbon nanotubes (CNTs) to titanium substrates is demonstrated by active vacuum brazing at 820 °C with a Ag–Cu–Ti alloy and at 880 °C with a Cu–Sn–Ti–Zr alloy. The brazing methodology was elaborated in order to enable the production of highly electrically and thermally conductive CNT/metal substrate contacts. The interfacial electrical resistances of the joints were measured to be as low as 0.35 Ω. The improved interfacial transport properties in the brazed films lead to superior electron fieldemission properties when compared to the as-grown films. An emission current of 150 μA was drawn from the brazed nanotubes at an applied electric field of 0.6 V μm−1. The improvement in electron field-emission is mainly attributed to the reduction of the contact resistance between the nanotubes and the substrate. The joints have high re-melting temperatures up to the solidus temperatures of the alloys; far greater than what is achievable with standard solders, thus expanding the application potential of CNT films to high-current and high-power applications where substantial frictional or resistive heating is expected