1. BEOL Process Effects on ePCM Reliability
- Author
-
A. Redaelli, A. Gandolfo, G. Samanni, E. Gomiero, E. Petroni, L. Scotti, A. Lippiello, P. Mattavelli, J. Jasse, D. Codegoni, A. Serafini, R. Ranica, C. Boccaccio, J. Sandrini, R. Berthelon, J.-C. Grenier, O. Weber, D. Turgis, A. Valery, S. Del Medico, V. Caubet, J.-P. Reynard, D. Dutartre, L. Favennec, A. Conte, F. Disegni, M. De Tomasi, A. Ventre, M. Baldo, D. Ielmini, A. Maurelli, P. Ferreira, F. Arnaud, F. Piazza, P. Cappelletti, R. Annunziata, and R. Gonella
- Subjects
reliability ,emerging memory ,Germanium ,Resistance ,Dispersion ,Electronic, Optical and Magnetic Materials ,Metals ,Programming ,28nm FDSOI ,BEOL ,Ge-rich GST ,embedded memory ,Electrical and Electronic Engineering ,GST ,Crystallization ,Biotechnology ,ePCM - Published
- 2022