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The simple phenomenological model and analytical approach of electromigration in the two-phase alloy (solder) under combined influence of the Kirkendall effect, backstress and sedimentation is presented. It is compared with electromigration in pure metal under condition of quasi-equilibrium vacancies (unlimited power of vacancy sinks-sources) and electromigration in pure metal with account of nonequilibrium vacancies. [ABSTRACT FROM AUTHOR]

We present the first simple analytical description of the interdiffusion process where the competition between the Kirkendall shift and the backstress is considered. It is shown that two diffusion subzones are formed; these sections are linked to the fast and slow diffusing component. During the interdiffusion process, the stress effect does not vanish. [ABSTRACT FROM AUTHOR]