Search

Mechanical anisotropy and point defects would greatly affect the product quality while producing silicon wafers via diamond-wire cutting. For three major orientations concerned in wafer production, their mechanical performances under the nanoscale effects of a point defect were systematically investigated through molecular dynamics methods. The results indicated anisotropic mechanical performance with fracture phenomena in the uniaxial deformation process of monocrystalline silicon. Exponential reduction caused by the point defect has been demonstrated for some properties like yield strength and elastic strain energy release. Dislocation analysis suggested that the slip of dislocations appeared and created hexagonal diamond structures with stacking faults in the [100] orientation. Meanwhile, no dislocation was observed in [110] and [111] orientations. Visualization of atomic stress proved that the extreme stress regions of the simulation models exhibited different geometric and numerical characteristics due to the mechanical anisotropy. Moreover, the regional evolution of stress concentration and crystal fracture were interrelated and mutually promoted. This article contributes to the research towards the mechanical and fracture anisotropy of monocrystalline silicon. [ABSTRACT FROM AUTHOR]

The dispersion characteristics of propagating modes in a lossy parallel-plate uniaxial chiro-omega waveguide are examined, and numerical results are presented to show the influences of bianisotropy, chirality, and omega parameter on the propagation constant and attenuation rate of different hybrid modes. Furthermore, the field distributions of one- and three-order modes are demonstrated, and the lossy effect is taken into consideration. [ABSTRACT FROM AUTHOR]