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A nonvolatile memory technology utilizing reversible changes between fcc and hcp crystalline phases is proposed. In this new type of phase-change memory, data are stored in different forms of crystalline phases of (Ge/sub 1/Sb/sub 2/Te/sub 4/)/sub 0.8/(Sn/sub 1/Bi/sub 2/Te/sub 4/)/sub 0.2/ chalcogenide alloy. RESET operation produces the less conductive metastable fcc phase via melt-quenching from the more conductive stable hcp phase and SET operation involves a phase change from fcc directly to hcp. Both RESET and SET operations can be completed as fast as 70 ns with large changes in cell resistance.

Ge2Sb2Te5 is under intense investigation for phase-change memory devices, including rewriteable DVDs where optical illumination is used to switch between the glassy and crystalline states. We investigate the influence of optical irradiation on amorphous phase. Many chalcogenides display photo-oxidation, photodarkening or photo-bleaching, but little has been reported on the Ge-Sb-Te system. Using spectroscopic ellipsometry (SE) and secondary ion mass spectrometry, we determine that the samples have a strong tendency to photo-oxidize; if this is not accounted for, then the analysis of SE data appears to show photodarkening. Other authors recently reported photodarkening in nonstoichiometric GexSb20-xTe80 [Pamukchieva et al., Proc. SPIE 5581, 608 (2004); Pamukchieva et al., J. Optoelectron. Adv. Mater 7, 1277 (2005)], but our analysis suggests that the changes were also the result of photo-oxidation. The oxide has lower value of (n, k) than Ge2Sb2Te5, and can be etched by hydrofluoric acid or water. The photo-oxidation is presumably the result of free carrier generation in the Ge2Sb2Te5. Our observation of negligible photodarkening is consistent with previous works that found less photodarkening in tellurides compared with selenides or sulfides, and that an increase in the mean coordination number, here by Ge addition, further reduces the photodarkening effect.

Amorphous Ge 2 Sb 2 Te 5 clusters with a size of 20 nm, self-enclosed by a thin layer of TiO x , were obtained by cosputtering Ge 2 Sb 2 Te 5 and TiO 2 targets at room temperature with the aim of reducing the reset current for phase change random access memory applications. Eutectic decomposition during the deposition caused a phase separation of Ge 2 Sb 2 Te 5 and TiO x . The temperature-dependent resistance change results showed that the activation energy for crystallization increased from 2.44 ± 0.76 to 3.84 ± 1.43 eV in the Ge 2 Sb 2 Te 5 film. The set resistance can be tuned within an acceptable range, and the reliability of this microstructure during repetitive laser melt-quenching cycles was tested.

The chemical instability of line patterned Ge2Sb2Te5 was studied by transmission electron microscopy after electrically inducing melt and solidification. Compositional analysis showed elemental separation of Te to the anode side, while Ge and Sb mutually separated at the cathode side. Such elemental separation of Ge2Sb2Te5 is explained by the electric field effects and thermodynamic driving forces.

We report the breakdown behavior of a patterned Ge2Sb2Te5 multiline structure during the voltage-driven electric stress biasing. Scanning Auger microscope analysis shows that the breakdown process accompanies with a phase separation of Ge2Sb2Te5 into an Sb, Te-rich phase and a Ge-rich phase. The phase separation is explained by the incongruent melting of Ge2Sb2Te5 based on the pseudobinary phase diagram between Sb2Te3 and GeTe. It is claimed that this phase separation behavior by incongruent melting provides one of the plausible mechanisms of the device failure in a phase change memory.

The thermal conductivity of thin films of the phase-change material Ge2Sb2Te5 is measured in the temperature range of 27°C