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As alternatives, metallic/nonmetallic bone graft materials play significant roles in bone defect surgery to treat external trauma or bone disease. However, to date, there are rather limited long-term implantable materials owning to in situ molding incapability of metallics and poor mechanical property of nonmetallics. Here, Bi-based low melting point alloy, with unique properties of injectability, solid-liquid phase transition, mechanical capability, and biocompatibility, present obvious long-lasting bone affinity as the excellent artificial bone-substitute. It is particularly necessary to point out that the targeted injected Bi alloy remains in its original position for up to 210 days without moving, as well as, displays good osseointegration ability to resolve repeated revision trauma caused by losing bone repair material. Additionally, with outstanding electrical and thermal conductivity, an unconventional way using Bi alloy to realize very beneficial hyperthermia analgesia via non-invasive wireless energy delivery is first proposed, which avoids adverse effects on bone remodeling inflicted by traditional drugs. The significantly decreased expression of pain sensitizing factor, such as, interleukin-6, neuropeptide substance, and transient receptor potential vanilloid 1 reveals the potential mechanism of hyperthermia analgesia. The present findings suggest the combination therapy of Bi alloy in bone repair and analgesia, which owns far-reaching clinical application value., (© 2021 The Authors. Advanced Science published by Wiley-VCH GmbH.)

Bi alloy was injected in situ into bone defects to replace bone tissue for support. Bone Defect Repair: Injectable Affinity and Remote Magnetothermal Effects of Bi-Based Alloy for Long-Term Bone Defect Repair and Analgesia (Adv. Sci. 14/2021) At the same time, compared with the transmission of nerve sensory information in the normal part, the continuous temperature control (40-45 °C) of Bi alloy induced by the remote alternation magnetic field of the magnetic coil blocked the transmission of pain signals from the nerve fibers around the bone defect to the spinal cord and brain, thus alleviating pain. [Extracted from the article]

As soft conductive materials with high liquid fluidity, the room‐temperature liquid metal alloys (LMs) offer a superior alternative to the fabrication of flexible electronics. So far, techniques aiming at patterning LMs are seriously limited by the alloy's high surface tension and poor wettability with many substrates. Additionally, LMs based mass production with fast and efficient printing on desired target still encounters tremendous unsolved challenges. Here, a one‐step liquid metal transfer printing method with wide range substrate adaptability, comprising of polymer‐based adhesive glue, its printing machine, the LMs ink, and the soft substrate is presented. It is demonstrated that even on those substrates with weak wettability to LMs, the liquid metal transfer printing still works well to create complex conductive geometries, multilayer circuits, and large‐area conductive patterns with excellent transfer efficiency, facile fabrication process, and remarkable electrical stability, which is beneficial to quickly construct wearable electronics, 3D folding conductive structures, flexible actuators, soft robots, etc. Moreover, its advantages of self‐healing and recyclable ability make the strategy possible to prepare reconfigurable circuits and further reduce the cost of fabrication and environmental pollution. This study suggests an important way for future widespread practices of liquid metal soft functional electronics. A one‐step liquid metal transfer printing method for flexible electronics based on adhesion difference of EGaIn on allied substrates is developed. The EGaIn could be adhered to polymethacrylates glue, but not paper. This fabrication method has five advantages: (1) fast fabrication; (2) excellent electrical stability; (3) simple to fabricate multilayer and large‐area circuits; (4) self‐healing ability; (5) reversion of EGaIn. [ABSTRACT FROM AUTHOR]