1. Physics-Based Gridding for Electrical Package Analysis Codes.
- Author
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Rubin, Barry J.
- Subjects
- *
ELECTRONIC packaging , *ELECTRICAL conductors , *ELECTRIC capacity , *COMPUTER algorithms , *INTEGRATED circuit interconnections , *INTEGRATED circuits , *PHYSICS - Abstract
This paper describes techniques and advances for mesh generation and refinement for the analysis of electrical package structures. After a brief review of meshing techniques, a physically based justification is provided for the basic elements of gridding required to accurately represent the following physical issues: edge-effects, projection gridding for signal return currents, conductor proximity, skin-effect, frequency effects, and dielectrics. These individual gridding components are then incorporated into a comprehensive, global algorithm. Many other meshing issues are addressed, including constraints associated with the underlying electromagnetic calculation kernel, removal of superfluous grid lines, assuring symmetric results for symmetric structures, and consistency related to causality and nonphysical effects. A number of 2D and 3D examples are taken from various codes developed by the author and novel techniques are given for effectively gridding 2D structures having even extreme geometric aspect ratios. [ABSTRACT FROM AUTHOR]
- Published
- 2010
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