1. Reliability Assessment of Delamination in Chip-to-Chip Bonded MEMS Packaging.
- Author
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Swaminathan, Rajesh, Bhaskaran, Harish, Sandborn, Peter A., Subramanian, Gowrishankar, Deeds, Michael A., and Cochran, Kevin R.
- Subjects
INTEGRATED circuits ,MICROELECTROMECHANICAL systems ,ELECTRONIC circuits ,REDUCED instruction set computers ,SIMULATION methods & models ,ACOUSTIC microscopy - Abstract
The bond layer is often the weakest link in the reliability of chip packages in the integrated circuit (IC) industry. Micro-electrical-mechanical systems (MEMS) packages are no exception to this trend. This paper presents a nondestructive methodology for determining delamination in chip-to-chip bonded MEMS. Experimental methods are used to determine the adhesive layer strength in samples subjected to environmental testing, and the reliability of the bonding layer is investigated. A simulation is performed using inputs from scanning acoustic microscopy, and simulation model results are correlated with the experimental die shear measurements to establish the validity of the nondestructive methodology for determining adhesive layer strength. [ABSTRACT FROM AUTHOR]
- Published
- 2003
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