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In this paper, a novel termination (“match”) scheme is introduced with absorbing material for high-frequency measurements. Through the absorption of electromagnetic waves, absorbing material makes an equivalent absorbing boundary condition at the interface, which creates an equivalent termination condition. The absorbing termination can be used to facilitate on-demand match condition in high-frequency measurements. The proposed technique is particularly useful when resistive termination is difficult to implement or too expensive to apply. For example, the soldering process (soldering-on soldering-off) is time-consuming, hard to control on the precise soldering position, and easy to break the printed circuit board soldering pads. It is useful for various applications, including via crosstalk measurements in socket, package breakout via array, or other dense/fine structures. The absorbing termination method provides an innovative termination solution for RF/microwave measurements. [ABSTRACT FROM PUBLISHER]

In this paper, we propose and investigate two novel applications of absorbing materials to suppress high-frequency couplings in high-speed interconnects. In the first application, absorbing materials are added to connector housing to reduce the noises caused by crosstalk and resonances. In the second application, a low-emission inductor is proposed by applying absorbing materials surrounding the body of an inductor. Full-wave simulations and measurements are performed to verify the proposed techniques. Results show absorbing materials significantly improve the performance of signal/power integrity and greatly reduce electromagnetic interference for high-speed digital system designs. [ABSTRACT FROM PUBLISHER]

A new technology is developed for the mitigation of stub effects in high-speed interconnects. This technology substantially reduces the stub effects for high-speed signaling. It dampens reflected signals on stubs, thus reducing intersymbol interference and harmful coupling, and correcting timing jitter, all typically induced by the stub’s reflected signals. This paper shows two applications for high-speed digital system designs, the mitigation of via stub effects and that of empty connector effects, respectively. However, it is notable that the present method is suitable for reflection suppression for arbitrary types of stubs to improve the signal integrity. [ABSTRACT FROM PUBLISHER]