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Your search keyword '"Sleeckx, E."' showing total 1 results
Start Over Author "Sleeckx, E." Topic 3d integration
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1. Integration challenges of copper Through Silicon Via (TSV) metallization for 3D-stacked IC integration

Author

Olmen, J. Van, Huyghebaert, C., Coenen, J., Aelst, J. Van, Sleeckx, E., Ammel, A. Van, Armini, S., Katti, G., Vaes, J., Dehaene, W., Beyne, E., and Travaly, Y.

Subjects
*ELECTRIC connectors, *INTEGRATED circuits, *SILICON, *COPPER, *METAL coating, *THREE-dimensional imaging, *CRYSTAL oscillators, *ELECTRONICS
Abstract

Abstract: In this paper we will highlight key integration issues that were encountered during the development of the 3D-stacked IC Through Silicon Via (TSV) module and present solutions to achieve a robust copper TSV. Electrical performance of the obtained TSV module is discussed based on a lumped RC model for 3D ring oscillators containing TSVs between bottom and top tiers. [Copyright &y& Elsevier]

Published
2011
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