1. Reliability of inkjet printed silver nanoparticle interconnects on deformable substrates tested through an electromechanical in-situ technique
- Author
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Tobias Cramer, Martina Aurora Costa Angeli, Pasquale Vena, Luca Magagnin, Dario Gastaldi, Beatrice Fraboni, Costa Angeli, Martina Aurora, Cramer, Tobia, Fraboni, Beatrice, Magagnin, Luca, Gastaldi, Dario, and Vena, Pasquale
- Subjects
Materials science ,business.industry ,Drop (liquid) ,FLEXIBLE ELECTRONICS, INKJET PRINTING, STRAIN SENSORS ,02 engineering and technology ,010402 general chemistry ,021001 nanoscience & nanotechnology ,01 natural sciences ,Silver nanoparticle ,Flexible electronics ,0104 chemical sciences ,Vertical direction ,Optoelectronics ,General Materials Science ,Materials Science (all) ,0210 nano-technology ,business ,Inkjet printing - Abstract
Inkjet printing is a promising technology providing cost-effective method for processing various materials on deformable substrates. In this work, linear and serpentine inkjet printed interconnects on two different substrates were fabricated and electromechanically characterized. A particular attention was given to the optimization of the process parameters; high quality can be achieved only printing slowly in vertical direction and optimizing the drop spacing to the specific pattern. The electromechanical results showed that the geometrical layout and printing direction strongly affect the printing quality and the electromechanical response; serpentine shapes should be preferred to straight interconnects as better gauge factors are obtained.
- Published
- 2019
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