1. Moisture resistance evaluation on single electronic package moulding compound
- Author
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Shu Ping Lin, Cher Ming Tan, Vivek Sangwan, Ching Hsiang Chen, Jia Yuan Chen, Guan Ling Seow, and Udit Narula
- Subjects
010407 polymers ,Materials science ,business.industry ,Extrapolation ,Humidity ,02 engineering and technology ,General Chemistry ,Integrated circuit ,021001 nanoscience & nanotechnology ,01 natural sciences ,Moisture resistance ,0104 chemical sciences ,law.invention ,Electronic packages ,law ,Materials Chemistry ,0210 nano-technology ,Process engineering ,business - Abstract
Non-destructive evaluation indices that correlate with the moisture resistance of integrated circuit packages are developed. These indices are developed from detailed studies on the functional groups in a moulding compound, and their effectiveness is verified experimentally. With these indices, one can ensure the moisture resistance of an individual package without the need of the standard humidity tests which require long test durations on limited number of samples where extrapolation with statistical uncertainty will be present.
- Published
- 2020
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