1. Whole process analysis of microstructure evolution during chip formation of high-speed machining OFHC copper
- Author
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Huijie Zhang, Binbin Xu, Jun Zhang, Wanhua Zhao, and Hongguang Liu
- Subjects
0209 industrial biotechnology ,Materials science ,Strategy and Management ,Chip formation ,02 engineering and technology ,Management Science and Operations Research ,021001 nanoscience & nanotechnology ,Microstructure ,Industrial and Manufacturing Engineering ,Finite element method ,Shear (sheet metal) ,020901 industrial engineering & automation ,Machining ,Boundary value problem ,Deformation (engineering) ,Composite material ,0210 nano-technology ,Shear band - Abstract
Higher cutting speed is always the pursuit of industries as it is one of the most effective methods to improve machining efficiency, which requires a better understanding of deformation and microstructure evolution process during chip formation. In this study, chip formation process is divided into three different sections of pre-loading, loading and unloading to analyze the mechanisms of microstructure evolution sequentially through a coupled finite element and cellular automata approach. The non-uniform distributed fields of strains, strain rates and temperatures induced by different stage during chip formation process are obtained and then transferred as boundary conditions for microstructure evolution. In pre-loading condition, microstructure evolution appears only along shear band with small sizes, which provides more boundaries for activation of DRX mechanisms in following conditions. Final microstructures always show a gradient distribution along shear direction, and secondary shear zone makes the greatest contribution to grain refinement. Average grain sizes and microstructure distribution have shown a good agreement between experimental data and simulation results, which indicates that this sequential simulation approach can perform a better description of those process characteristics of microstructure evolution during a continuous process with complicated boundary conditions.
- Published
- 2021
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