1. Detailing interfacial reaction layer products between cubic boron nitride and Cu-Sn-Ti active filler metal
- Author
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Yonggang Fan, Junxiang Fan, and Cong Wang
- Subjects
Materials science ,Filler metal ,Polymers and Plastics ,Mechanical Engineering ,Metals and Alloys ,Nucleation ,chemistry.chemical_element ,02 engineering and technology ,010402 general chemistry ,021001 nanoscience & nanotechnology ,Microstructure ,01 natural sciences ,Chemical reaction ,0104 chemical sciences ,chemistry.chemical_compound ,chemistry ,Chemical engineering ,Mechanics of Materials ,Boron nitride ,Materials Chemistry ,Ceramics and Composites ,Brazing ,0210 nano-technology ,Tin ,Layer (electronics) - Abstract
In the present study, we offer an in-depth analysis over the microstructure, thickness and product composition of the interfacial reaction layer generated upon CBN/Cu-Sn-Ti active filler metal at 1223 K. Current findings demonstrate that adequate wettability and satisfactory bonding have been achieved via chemical reactions between Ti and N, B. More importantly, we report, for the first time, the formation of a three-layer juxtaposition of reaction products, namely, TiN, TiB2 and TiB, along the diffusion path of Ti. Meanwhile, we determine the average layer thickness to be 1.24 μm. Through deep etching, we unambiguously present morphologies of the newly formed TiN and TiB2, which are columnar and bulky, respectively, and constitute the formation of a high strength metallurgical interfacial bonding layer, and is crucial towards gaining enhanced grinding performance. Finally, we propose a possible reaction sequence and mechanism that govern the nucleation and growth of corresponding crystals.
- Published
- 2021