1. Non-invasively improving the Schottky barrier of MoS2/metal contacts by inserting a SiC layer
- Author
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Xumei Zhao, Lin Yuan, Caijuan Xia, Boyu Wang, Fei Ma, and Qinglong Fang
- Subjects
Materials science ,Spintronics ,business.industry ,Schottky barrier ,Contact resistance ,Fermi level ,General Physics and Astronomy ,02 engineering and technology ,010402 general chemistry ,021001 nanoscience & nanotechnology ,01 natural sciences ,0104 chemical sciences ,symbols.namesake ,Semiconductor ,Electrode ,symbols ,Optoelectronics ,Physical and Theoretical Chemistry ,0210 nano-technology ,business ,Ohmic contact ,Quantum tunnelling - Abstract
The applications of two-dimensional (2D) materials in electronics, optoelectronics, and spintronics are limited by the high contact resistance at the metal/semiconductor interface owing to the strong Fermi-level pinning. In this study, an interlayer insertion strategy is proposed to solve this problem, and first principles calculations are done to study the influences of inserting a SiC layer on the Schottky barrier and electronic properties of MoS2/metals (Mg, Al, In, Cu, Ag, Au, Pd, Ti, and Sc). The average charge value substantially increased (≥0.060 e) at the interface between SiC and MoS2 layers, and then no tunneling barrier appeared except for the MoS2/Au contact by inserting the SiC layer. Moreover, ΦSB,N almost decreases for the MoS2/metal contacts by inserting the SiC layer. When Ti, Cu, Au, and Pd are used as electrodes, the n-type Schottky barrier is formed with the ΦSB,N values of 0.479 eV, −0.073 eV, 0.498 eV, and 0.225 eV, respectively. However, if Al, In, Mg, and Ag are used as electrodes, the systems are transformed into Ohmic contact. These findings provide a practical guideline for depinning the Fermi level at contact interfaces and designing the high performance TMD-based nanoelectronic devices.
- Published
- 2021
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