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Purpose This paper aims to present new analytical model for the filling times prediction in flip-chip underfill encapsulation process that is based on the surface energetic for post-bump flow. Design/methodology/approach The current model was formulated based on the modified regional segregation approach that consists of bump and post-bump regions. Both the expansion flow and the subsequent bumpless flow as integrated in the post-bump region were modelled considering the surface energy–work balance. Findings Upon validated with the past underfill experiment, the current model has the lowest root mean square deviation of 4.94 s and maximum individual deviation of 26.07%, upon compared to the six other past analytical models. Additionally, the current analytically predicted flow isolines at post-bump region are in line with the experimental observation. Furthermore, the current analytical filling times in post-bump region are in better consensus with the experimental times as compared to the previous model. Therefore, this model is regarded as an improvised version of the past filling time models. Practical implications The proposed analytical model enables the filling time determination for flip-chip underfill process at higher accuracy, while providing more precise and realistic post-bump flow visualization. This model could benefit the future underfill process enhancement and package design optimization works, to resolve the productivity issue of prolonged filling process. Originality/value The analytical underfill studies are scarce, with only seven independent analytical filling time models being developed to date. In particular, the expansion flow of detachment jump was being considered in only two previous works. Nonetheless, to the best of the authors’ knowledge, there is no analytical model that considered the surface energies during the underfill flow or based on its energy–work balance. Instead, the previous modelling on post-bump flow was based on either kinematic or geometrical that is coupled with major assumptions.

Purpose This paper aims to determine the optimum set of temperatures through correlation study to attain the most effective capillary flow of underfill in a multi-stack ball grid array (BGA) chip device. Design/methodology/approach Finite volume method is implemented in the simulation. A three-layer multi-stack BGA is modeled to simulate the underfill flow. The simulated models were well validated with the previous experimental work on underfill process. Findings The completion filling time shows high regression R-squared value of up to 0.9918, which indicates a substantial acceleration on the underfill process because of incorporation of thermal delta. An introduction of 11 °C thermal delta to the multi-stacks BGA managed to reduce the filling time by up to 16.4%. Practical implications Temperature-induced capillary flow is a relatively new type of driven underfill designed specifically for package on package BGA components. Its simple implementation can further improve the productivity of existing underfill process in the industry that is desirable in reducing the process lead time. Originality/value The effect of temperature-induced capillary flow in underfill encapsulation on multi-stacks BGA by means of statistical correlation study is a relatively new topic, which has never been reported in any other research according to the authors’ knowledge.

Purpose The purpose of the study is to investigate the spatial aspects of underfill flow during the flip-chip encapsulation process, for instance, meniscus evolution and contact line jump (CLJ). Furthermore, a spatial-based void formation mechanism during the underfill flow was formulated. Design/methodology/approach The meniscus evolution of underfill fluid subtended between the bump array and the CLJ phenomenon were visualized numerically using the micro-mesh unit cell approach. Additionally, the meniscus evolution and CLJ phenomenon were modelled analytically based on the formulation of capillary physics. Meanwhile, the mechanism of void formation was explained numerically and analytically. Findings Both the proposed analytical and current numerical findings achieved great consensus and were well-validated experimentally. The variation effects of bump pitch on the spatial aspects were analyzed and found that the meniscus arc radius and filling distance increase with the pitch, while the subtended angle of meniscus arc is invariant with the pitch size. For larger pitch, the jump occurs further away from the bump entrance and takes longer time to attain the equilibrium meniscus. This inferred that the concavity of meniscus arc was influenced by the bump pitch. On the voiding mechanism, air void was formed from the air entrapment because of the fluid-bump interaction. Smaller voids tend to merge into a bigger void through necking and, subsequently, propagate along the underfill flow. Practical implications The microscopic spatial analysis of underfill flow would explain fundamentally how the bump design will affect the macroscopic filling time. This not only provides alternative visualization tool to analyze flow pattern in the industry but also enables the development of accurate analytical filling time model. Moreover, the void formation mechanism gave substantial insights to understand the root causes of void defects and allow possible solutions to be formulated to tackle this issue. Additionally, the microfluidics sector could also benefit from these spatial analysis insights. Originality/value Spatial analysis on underfill flow is scarcely conducted, as the past research studies mainly emphasized on the temporal aspects. Additionally, this work presented a new mechanism on the void formation based on the fluid-bump interaction, in which the formation and propagation of micro-voids were numerically visualized for the first time. The findings from current work provided fundamental information on the flow interaction between underfill fluid and solder bump to the package designers for optimization work and process enhancement.

This study presents experimental and numerical works on porous media burner. The influence of ultra-low vegetable oil droplets on burner performance was investigated. A unique dual-layer microporous media burner was fabricated to generate surface and submerged flames under lean conditions. Optimum equivalence ratio under lean conditions for surface and submerged flames was recorded at 0.7 and 0.5, respectively. The performance of the burner was examined by adding vegetable oil droplets of 20, 40, 60, or 80 $$\upmu \hbox {L}$$ externally on the surface of reaction layer. At 80 $$\upmu \hbox {L}$$ , the burner was at its best performance, while $$>80 ~\upmu \hbox {L}$$ leads to unstable flames. The maximum thermal efficiency of the burner under surface flame without droplets was found out to be 90%, which was enhanced to 94% by enabling 80 $$\upmu \hbox {L}$$ of vegetable oil. Similarly, with submerged flame maximum thermal efficiency progressively improved from 38 to 45%. The impact of vegetable oil at the microscopic level was determined by performing scanning electron microscopy and X-ray diffraction analysis. Digital thermal images were captured at critical ER to ensure a stable combustion. The emitted combustion gases were monitored continuously to detect the emissions (NOx and CO). These emissions were within controlled limits. Finally, three-dimensional numerical study was performed to effectively comprehend the experimental data for both temperature and emissions.

Purpose This paper aims to investigate the characteristics of ultra-fine lead-free solder joints reinforced with TiO2 nanoparticles in an electronic assembly. Design/methodology/approach This study focused on the microstructure and quality of solder joints. Various percentages of TiO2 nanoparticles were mixed with a lead-free Sn-3.5Ag-0.7Cu solder paste. This new form of nano-reinforced lead-free solder paste was used to assemble a miniature package consisting of an ultra-fine capacitor on a printed circuit board by means of a reflow soldering process. The microstructure and the fillet height were investigated using a focused ion beam, a high-resolution transmission electron microscope system equipped with an energy dispersive X-ray spectrometer (EDS), and a field emission scanning electron microscope coupled with an EDS and X-ray diffraction machine. Findings The experimental results revealed that the intermetallic compound with the lowest thickness was produced by the nano-reinforced solder with a TiO2 content of 0.05 Wt.%. Increasing the TiO2 content to 0.15 Wt.% led to an improvement in the fillet height. The characteristics of the solder joint fulfilled the reliability requirements of the IPC standards. Practical implications This study provides engineers with a profound understanding of the characteristics of ultra-fine nano-reinforced solder joint packages in the microelectronics industry. Originality/value The findings are expected to provide proper guidelines and references with regard to the manufacture of miniaturized electronic packages. This study also explored the effects of TiO2 on the microstructure and the fillet height of ultra-fine capacitors.

Consistent with the recent trends in which the flip-chip reliability and performance being prominently prioritized, this paper is devoted to study the effects of solder bump shapes on the capillary underfill flows during the flip-chip encapsulation. A new experimental approach based on the particle image velocimetry (PIV) is set-up to visualize the underfill flow in the flip-chip. A more generalized analytical model for predicting the underfill filling time was developed to be applied for the triple-inlets dispensing (U-shape) underfill process with its application extended to a more generic bump shape. The theoretical analysis based on averaging method has been found viable for prediction of the underfill pressure, velocity and permeability. Findings from both finite volume method (FVM) simulation and PIV experiment achieved great consensus and are in line with the new theoretical estimates. These three distinct methodologies independently concluded the direct impact of different bump shapes design on the underfill flow. Altering the truncated spherical-shaped bump into a narrow-neck bump, for instance hourglass and concave shapes, would respectively reduce the filling times by 8.86% and 11.4% respectively; apart from having the increase in flow pressure and velocity. The mean permeability of the bump array computed is observed to be in an increasing order starting from spherical, cylindrical, hourglass and concave shapes. Generally, this comprehensive study had identified the geometrical parameters of solder bump that necessitated for faster underfill flow, being low sphericity and high pad-to-neck ratio.

This paper presents the influence of Fe2O3 nanoparticles on the microstructure and fillet height for the ultra-fine electronics assembly in the reflow soldering process. Lead-free SAC solder paste was reinforced with different weighted percentages of Fe2O3 nanoparticles (i.e., 0.01, 0.05, and 0.15 wt.%) using a mechanical solder paste mixer. A new form of nano-reinforced lead-free solder paste was applied to assemble the ultra-fine capacitor (i.e., 01005 size) onto the printed circuit board by applying the reflow soldering method. Focused ion beam (FIB), high-resolution transmission electron microscope (HRTEM) system equipped with energy-dispersive X-ray spectroscopy (EDS), field emission scanning electron microscopy coupled with energy-dispersive X-ray spectroscopy (EDS), and nanoindentation tester, were all used to examine the microstructure, hardness, and the fillet height of the solder joints. The experimental results revealed that nano-reinforced solder with the content of 0.01, 0.05, and 0.05 wt% yielded small changes in the intermetallic layers. Furthermore, applying an increment of Fe2O3 to 0.05 wt% also improved the fillet height. The mechanism of the agglomeration of Fe2O3 in the bulk solder is discussed in this study. Moreover, simulation analysis using the volume of fluid (VOF) and discrete phase method (DPM) was both employed to describe the mechanism of nanoparticle distribution in the solder and the reflow soldering process. The findings are expected to provide profound knowledge and further reference towards the reflow soldering process of the miniaturised electronic package.

This paper presents a 3D numerical simulation of nano-reinforced lead (Pb)-free solder at the ultra-fine joint component for 01005 capacitor with dimension of 0.2 × 0.2 × 0.4 mm 3 . The nano-reinforced particles introduced in the Sn-3.0Ag-0.5Cu (SAC305) solder is titanium oxide (TiO 2 ) nanoparticles with approximate diameter of ≈ 20 nm at different weight percentages of 0.01, 0.05 and 0.15 wt% respectively. The 3D model developed is based on the reflow thermal profile of nano-reinforced Pb-free solder in the wetting zone temperature of 217 °C–239 °C. A two way interactions utilizing both volume of fluid method (VOF) and discrete phase method (DPM) are introduced in the current study. The study effectively shows the distribution of the nanoparticles as it is being doped in the molten solder after undergoing soldering process. Based on the findings, it was shown that good agreement can be seen between experimental data obtained using High Resolution Transmission Electron Microscope (HRTEM) system as compared to multiphase DPM based simulation. At weight percentage of SAC305 + 0.05% TiO 2 nanoparticles, the nanoparticles are well distributed. The fillet height of nano-reinforced solder also meets the minimum requirement for 01005 capacitor. Additionally, as the weight percentage of the doped nanoparticles increases, the time required for the formation of wetted solder also increases. In terms of the velocity and pressure distribution of the nano-reinforced lead (Pb)-free solder, higher weight percentage of doped nanoparticles have higher velocity distribution and lower pressure distributions.

No-flow underfill process can enhance the production lead time since the curing and reflow of solder interconnect and underfill are achieved simultaneously. Additionally, no-flow underfill can produce near void-free flow during the assembly process. This paper investigates the effect of chip placement speed towards the void formation of no-flow underfill process using numerical simulation and experimental methods. The findings show that the increase in chip placement speed effectively increased the gauge pressure and velocity of the underfill flow. The highest chip placement speed of 14 ​mm/s produces 12,300 ​Pa of gauge pressure and 0.1 ​m/s of underfill flow velocity. The flow profiles revealed that finger-like profile was formed above 5 ​mm/s speed during the compression process of no-flow underfill that will lead to issue of void formation in the ball grid array (BGA) region. This study recommended the usage of below 5 ​mm/s of chip placement speed to minimize the issue of finger-like formation and subsequently void formation.

Purpose This paper aims to present experimental and finite volume method (FVM)-based simulation studies on the scaling effect on the capillary contact angle and entrant pressure for a three-dimensional encapsulation process of ball-grid array (BGA). Design/methodology/approach With the development of various sizes of BGA packages, the scaling effect of BGA model on capillary underfill (CUF) process is investigated together with the influences of different industrial standard solder bump arrangements and dispensing methods used as case study. Findings The experimental results agree well to the simulation findings with minimal deviation in filling time and similar flow front profiles for all setups. The results revealed that the capillary contact angle of flow front decreases in scale-up model with larger gap height observed and lengthens the encapsulation process. Statistical correlation studies are conducted and accurate regression equations are obtained to relate the gap height to the completion filling time and contact angle. CUF threshold capillary pressures were computed based on Leverett-J function and found to be increasing with the scale size of the package. Practical implications These statistical data provide accurate insights into the impact of BGA’s scale sizes to the CUF process that will be benefiting the future design of BGA package. This study provided electronic designers with profound understanding on the scaling effect in CUF process of BGA, which may be extended to the future development of miniature-sized BGA and multi-stack device. Originality/value This study relates the flow behaviour of encapsulant to its capillary contact angle and Leverett-J pressure threshold, in the CUF process of different BGA and dispensing conditions. To date, no research has been found to predict the threshold pressure on the gap between the chip and substrate.

The fluid/structure interaction (FSI) investigations of stacked chip in encapsulation process of moulded underfill packaging using the two-way Coupling method with ANSYS Fluent and ANSYS Structural solvers are presented. The FSI study is executed with different aspect ratio of stacked chip on the mould filling during the encapsulation process. The simulation results in the FSI study is well validated with experimental setup. The epoxy moulding compound (EMC) and structure (chip) interaction is analyzed for better understanding the FSI phenomenon.Von Mises stresses experienced by the chip also be monitored for risk of chip cracking. The proposed analysis is anticipated to be a recommendation in the chip design and improvement of 3D integration packages.

This paper presents a new analytical filling time model to predict the flow of non-Newtonian underfill fluid during flip-chip encapsulation process. The current model is formulated based on the regional segregation approach, instead of the conventional porous media approximation. In this approach, the filling times were computed separately at different filling stages, before being summed up till the required filling distance. The non-Newtonian property of underfill fluid is modeled using the conventional power-law constitutive equation. Additionally, the spatial aspects of the underfill flow were incorporated into the present analysis. For instance, the evolution of underfill menisci from convex to concave was analytically developed and the contact line jump (CLJ) criterion was improved using minimal flow assumption. Upon validated with three distinct past underfill experiments, the current analytical model is found to have the best performance as it predicted the filling times with the least discrepancy among other existing filling time models. Quantitatively, the discrepancies were averagely reduced by an absolute value of at least 8.68% and 4.90%, respectively, for the first two set of validation studies. Generally, this model is particularly useful in manufacturing lines to estimate the process time of flip-chip underfill, as well as for the optimizations of process and package design.

Recent trend in electronic industries are demanding smaller chip packaging process along with increase in performance and reliability of the package. The introduction of Multi-stack Ball Grid Array (BGA) to enhance the performance of the conventional BGA flip chip has frequently encountered several hitches such as extended filling time and incomplete filling at the upper layer of the multi-stacks BGA. It has been found that the encapsulant lacks energy to flow at the upper layer due to lower hydrostatics pressure. In this paper, a straightforward solution by incorporating additional thermal energy in the encapsulant to increases its flow ability is introduced. This additional thermal energy at the upper layer produces a distinct temperature difference between the upper and lower layers, or simply thermal delta. This research attempts to demonstrate the effectiveness of thermal delta in solving the aforementioned flow problem during encapsulation process of multi-stacks BGA, by means of experiment and numerical simulation. The findings have shown that the experimental data compares well with the simulation results. It was also found that the implementation of thermal delta substantially reduces the filling time across the multi-stack packages. This study reveals the potential of thermocapillary-driven underfill encapsulation being widely adopted in future industrial encapsulation of multi-stacks BGA packaging.

The current study applied the lattice Boltzmann method to examine the effects of stacking chips layout to the micro-void formation in three-dimensional (3D) packaging. Three-dimensional 19-velocities commonly known as D3Q19 scheme is utilized in this study. Three different cases, which are different in layout design, are examined. For code verification purpose, an experimental work is also presented to compare the flow front results between numerical and experimental at different filling percentage. The numerical predictions compared well with the experimental results. Minor differences are observed in their flow front profile. The numerical findings identified the predicted locations of micro-void formation during the encapsulation process. The entrapment of micro-void was visualized clearly in the simulation because of the unbalanced molecular force at the interface during encapsulation. Knit lines were also identified at the interface between the flows that occurred in the encapsulation. Different layout of stacking flip-chips package have influence the micro-void in the package, which tended to form at the stacking chips region. The results show that the lattice Boltzmann method has a good performance in the IC encapsulation simulation.

Underfill encapsulation play an important role to improve the reliability of flip chip package, yet the conventional underfill (CUF) encapsulation process is subjected to several drawbacks such as extended filling time, incomplete filling and voids formation. Therefore, the focal point of this project is on the study of different CUF dispensing method for different types of ball grid array (BGA) orientations. The experimental works and numerical simulations were performed to predict the interaction of fluid on the structure and the results from both studies have reached a good agreement. This paper explores the effect of BGA orientations and dispensing types namely I, L and U on the behavior of underfill flow and the filling time. This study reveals the potential of both aspects in improving the efficiency of CUF encapsulation. The findings show that of all 9 different combinations of orientations and dispensing type, the fastest filling time is achieved by combining perimeter orientations with U-type flow. However, it suffers from racing effect that might lead to possible voids formation. The findings are then applied on real size 16×16 BGA and it was found that the flow front propagation changed from concave to convex shape for small size BGA and the filling time is also highly dependent on the BGA size and the solder ball count. Display Omitted This paper study the effect of I, L and U dispensing types on three common BGA orientations in terms of its flow attributes.3D multiphase setup of ILU dispensing encapsulation process based on scale up and real size BGA models for 6×6 and 16×16 BGA.Combination of U-type perimeter orientation has the fastest filling time and the slowest is given by I-type full orientation.Flow front propagation changed from concave to convex shape for small size BGA.The overall filling time and flow characteristics are highly dependent on the BGA size and the solder ball count.

This paper studies effects of different bump orientations on the void formation using Lattice Boltzmann method (LBM) based software. Prediction of air void is vital typically at the onset of reflow soldering which could reduce the reliability of the mold cavity. The effect of variations in pressure and velocity of the mold during flow on the formation of air voids are investigated for three different ball grid array (BGA) orientations namely perimeter, middle empty and full. The findings identified the predicted locations of void formation during the underfill encapsulation process. It was shown that middle empty orientation has the highest potential of void formation typically towards the end of mold flow as a result of low pressure and high velocity flow. In addition, using high bond number and high viscosity material could further reduce the air void formation.

Prediction of void occurrence during capillary underfill encapsulation process is vital to avoid package failure due to incomplete filling during the encapsulation process. Two design variables, namely the gap height and package orientations, together with different types of industrial standard design of dispensing methods were identified as possible influences to the void formation in encapsulated package. In this paper, all these factors have been closely related to the void formation and subsequently the best chip design has been formulated to improve package reliability. From the study, air entrapment is clearly visualized in the experiment, which can be detrimental as it contains trapped oxygen, which can combust at high temperature. A series of experiments eventually showed higher possibility of air void formation by U-type dispensing method compared with the L-type dispensing method. In addition, it is found that the chip design parameters that include the scaling size and ball grid array orientation have an effect on the size of void formed. Our experimental findings were validated using lattice-Boltzmann method simulation and great consensus is found between both approaches. These findings provide additional insights to the electronic packaging developer to effectively reduce the formation of void during encapsulation process.

A numerical assessment on the solution performance of adaptive finite element methods for fluid–structure interaction (FSI) is presented in this paper. The partitioned-based approach involving separate fluid and structure solvers is considered for adaptive finite element computation with triangular mesh. The performance of the hp-adaptivity, in which error in energy norm is reduced by way of mesh refinement (h) and polynomial order extension (p), is of particular interest. In addition, parallel solution process based on the domain decomposition method is also assessed due to the complexity of two way coupling scheme. Based on its numerical convergence, the hp-adaptive procedure for the FSI problem is shown to yield the fastest convergence as generally expected. Moreover, our domain decomposition parallelization scheme shows reduction in the computation time by up to order 2. Subsequently, the convergence performance is highly dependent on the aspect ratios of the triangular elements. The solution performance strongly suggests the viability of the parallel hp-adaptive method in partitioned-based FSI formulation.

This study investigated the influence of laminate properties toward the collapse of composite cross arm structure under multi-axial quasi-static loading. A three-dimensional finite-element model of a cross arm was developed and integrated with Hashin’s failure subroutine to predict the inter-laminar damages of the composite upon its application. The mechanical deformation and failure of the composite structure were evaluated over three laminate properties. This investigation revealed that variation in laminates properties yielded different structural deflection and laminate damages. The cross arm with a greater young modulus and ultimate stresses (laminate B) experienced a single failure mode of fiber buckling in compression at deflection of 0.082 m. For the given multi-axial load, the laminate configuration and properties considered in this study failed to prevent the failure of the cross arm.

This paper simulates and predicts the laminar flow inside the 3D aneurysm geometry, since the hemodynamic situation in the blood vessels is difficult to determine and visualize using standard imaging techniques, for example, magnetic resonance imaging (MRI). Three different types of Lattice Boltzmann (LB) models are computed, namely, single relaxation time (SRT), multiple relaxation time (MRT), and regularized BGK models. The results obtained using these different versions of the LB-based code will then be validated with ANSYS FLUENT, a commercially available finite volume- (FV-) based CFD solver. The simulated flow profiles that include velocity, pressure, and wall shear stress (WSS) are then compared between the two solvers. The predicted outcomes show that all the LB models are comparable and in good agreement with the FVM solver for complex blood flow simulation. The findings also show minor differences in their WSS profiles. The performance of the parallel implementation for each solver is also included and discussed in this paper. In terms of parallelization, it was shown that LBM-based code performed better in terms of the computation time required.

Through fluid/structure interaction (FSI) simulation and experimental work on a scaled-down dam model, the influence of radial gate height to the force exerted to the gate wall during water flow is studied. Both numerical and experimental findings gave results of great consensus, with their deviation not exceeding 14.66%. The water flow across the radial gate of the dam is visualized as modelled based on volume of fluid (VOF) scheme. It is found that the force exerted by water flow on the gate wall is the highest with intermediate gap height of 10 mm as compared to 8 mm and 10 mm.

Aeration is an important parameter in water filtration system as it allows the transfer of oxygen to water through turbulence effect which subsequently increases air entrainment in the water. For water treatment application, aeration efficiency is measured to ensure continuous re-oxygenation of the unfiltered water. Aside from aeration, this paper also studies the flow patterns through the use of particle image velocimetry (PIV) setup. Through the use of real scale down physical model laboratory study is performed using PIV to obtain the velocity profile. These velocity profiles will then be used to calculate the aeration efficiency of the water in a cascade aerator system. Based on the findings, the aeration efficiency obtained from the PIV experiment has a maximum value at the lowest point of the cascade aerator system with a value of 0.0139 due to increase in mass flow rate as it moves through the steps with velocity of 0.418 m/s. Therefore, in the design of a cascade aerator system, it is advisable to increase the number of steps since it will increase the aeration efficiency of the system.

The dynamic characteristics such as natural frequencies, mode shapes and frequency response function (FRF) are the important characteristics to be investigated to access the level of durability of any dam structures. These characteristics are important since it will be the reference information for any operational methods to be used for the dam structures. In this study, one of the real dam (i.e., Chenderoh Dam) that available in Malaysia is taken into consideration, where the dynamic analysis of the sector gate section of the dam structure is investigated. the real scale of the sector gate section is measured on site and modelled into the CAD software with the consideration of real build-in materials. Then, the finite element (FE) model is constructed in ANSYS software with the required boundary condition and meshing sensitivity analysis. From the result of modal analysis, 30 natural frequencies are determined in the range of 0.5904 Hz to 8.471 Hz together with the mode shapes but only the most significant natural frequencies will be shown in this paper. In addition, all three axes of the FRF graphs show an agreement for the highest natural frequency value at 7.95 Hz, where the maximum deflection occurred in x axis direction with 2.03 × 10-7 m.

This paper studies the three dimensional (3D) simulation of fluid flows through the ball grid array (BGA) to replicate the real underfill encapsulation process. The effect of different solder bump arrangements of BGA on the flow front, pressure and velocity of the fluid is investigated. The flow front, pressure and velocity for different time intervals are determined and analyzed for potential problems relating to solder bump damage. The simulation results from Lattice Boltzmann Method (LBM) code will be validated with experimental findings as well as the conventional Finite Volume Method (FVM) code to ensure highly accurate simulation setup. Based on the findings, good agreement can be seen between LBM and FVM simulations as well as the experimental observations. It was shown that only LBM is capable of capturing the micro-voids formation. This study also shows an increasing trend in fluid filling time for BGA with perimeter, middle empty and full orientations. The perimeter orientation has a higher pressure fluid at the middle region of BGA surface compared to middle empty and full orientation. This research would shed new light for a highly accurate simulation of encapsulation process using LBM and help to further increase the reliability of the package produced.