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Ternary chalcogenides, such as parkerites and shandites, are a broad class of materials exhibiting a rich diversity of transport and magnetic behavior and an array of topological phases, including Weyl and Dirac nodes. However, they remain largely unexplored as high-quality epitaxial thin films. Here, we report the self-regulated growth of thin films of the strong spin–orbit coupled superconductor Pd3Bi2Se2 on SrTiO3 by molecular beam epitaxy. Films are found to grow in a self-regulated fashion, where, in excess Se, the temperature and relative flux ratio of Pd to Bi control the formation of Pd3Bi2Se2 due to the combined volatility of Bi, Se, and Bi–Se bonded phases. The resulting films are shown to be of high structural quality, and the stoichiometry is independent of the Pd:Bi and Se flux ratio and exhibits a superconducting transition temperature of 800 mK and a critical field of 17.7 ± 0.5 mT, as probed by transport and magnetometry. Understanding and navigating the growth of the chemically and structurally diverse classes of ternary chalcogenides open a vast space for discovering new phenomena and enabling new applications.

We describe a superconducting (SC) cable-to-cable connection method for thin-film flexible (Nb/polyimide) parallel transmission line cables that exhibits low loss from DC to microwave frequencies. Design, fabrication procedures, assembly methods and characterization results are reported. The connector assembly incorporates a monolithic array of short superconductive bridging traces that function as a ganged electrical splice between two ribbon cables. The assembly is micro-mechanically self-aligned and uses pressure to make simultaneous electrical contacts between multiple 50 μm wide microstrip signal traces, as well as between ground planes. Each contacting surface comprises thin SC Nb overcoated with ultra-thin Au, providing nearly zero DC resistance and very good RF performance. A simulation model of the microwave performance of microstrip-to-microstrip interconnections at 4.2 K was successfully matched to measurement results. This new cable-to-cable connection approach exhibited an insertion loss <0.12 dB and a return loss >15 dB up to 14 GHz. The connections performed reproducibly throughout multiple thermal cycles and multiple disassembly/reassembly cycles. [ABSTRACT FROM AUTHOR]