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With its excellent properties such as high thermal conductivity, strong radiation resistance and high electron mobility, diamond has become one of the most suitable materials for radiation detectors. Detector-grade diamond requires low impurity content, low dislocation density and other defects. However, it is very difficult to keep low impurities and low dislocations simultaneously in the actual crystal growth process. In this study, microwave plasma chemical vapor deposition (MPCVD) method was used to grow diamond layer on two high-quality HPHT diamond substrates with the previously optimized process conditions. The nitrogen impurity content and structure of the HPHT substrate and growth layer were characterized and analyzed. The results show that, the content of nitrogen impurity on two HPHT substrates are 7. 1 x 10-6% and 4. 04 x 10-8%, respectively, whereas in their epitaxial diamond layers, the nitrogen impurity content are 2. 1 x 10-7% and 5 x 10-8%, respectively. The full width at half-maximum of the rocking curve shows that the dislocation density of the MPCVD growth layer is comparable to the HPHT substrate, though some dislocations were introduced into the MPCVD growth layer, which increases the stress. Overall, the dislocations in the HPHT substrate and epitaxial layer of single crystal diamond are in the same order of magnitude. The high-purity single crystal diamond prepared in this work may be used in nuclear radiation detection and semiconductor fields. [ABSTRACT FROM AUTHOR]

Diamond exhibits large application potential in the field of power electronics, owing to its excellent and desirable electronic properties. However, the main obstacles to its development originate from the small‐sized single‐crystal wafers and the instability of the electrical conductivity. This work presents a metal‐oxide‐semiconductor field‐effect transistor (MOSFET) on a diamond substrate derived from a five‐inch (110) highly preferred polycrystalline diamond film. The MOSFETs with excellent performance are fabricated by combining an H‐terminated channel and an epitaxially grown boron‐doped layer as the source/drain contacts of the diamond devices. According to the electrical statistical results of ≈110 devices on the polycrystalline diamond substrate, 44% of devices show normally‐off operation with a maximum current density of 400 mA mm−1, while 56% of devices demonstrate normally‐on operation with a maximum current density of 525 mA mm−1. The normally‐off characteristics are more related to the higher amounts of nitrogen concentration than the grain boundaries. The stable boron‐doped source and drain provide a high concentration of holes, which facilitate transport in the surface p‐type channel induced by the H‐termination. The characteristics of the MOSFETs are inspiring for the fabrication of complementary inverter circuits on large diamond wafers. [ABSTRACT FROM AUTHOR]

[Display omitted] • A high channel hole mobility of 200 cm2V−1s−1 was achieved in C-Si interface (1 1 1) diamond MOSFETs. • The C-Si interface provides the MOSFETs with an excellent normally-off operation. • The advantage of boron doping in (1 1 1) diamond provides a large maximum current density. • The anatomically flat and strain-free interface between the (1 1 1) diamond and SiO 2 film was confirmed by HRTEM. • The existence of C-Si bonds at the interface was proved by EELS and XPS. In this paper, a diamond-silicon (C-Si) interface was constructed on a (1 1 1) diamond substrate by annealing the SiO 2 gate insulator in a reductive atmosphere. Corresponding metal-oxide-semiconductor field effect transistors (MOSFETs) with a C-Si conductive channel were fabricated. The MOSFETs demonstrate excellent normally-off operation with a high threshold voltage (V th) of −16 V and a high current density of −167 mA/mm, with a gate length (L G) of 4 μm. The channel hole mobility (μ FE) reaches 200 cm2V−1s−1 with a L G of 10 μm, and the interface state density (D it) is as low as 3.8 × 1011 cm−2 eV−1. The high-resolution transmission electron microscopy (HRTEM) image displays a coherent and strain-free interface between the SiO 2 film and (1 1 1) diamond, which ensures a high μ FE and low D it in the MOSFETs. The interface is dominated by C-Si bonds, which are confirmed by atomic-scale electron energy loss (EELS) quantification, spectroscopic characterization, and X-ray photoelectron spectroscopy (XPS). These results demonstrate that diamond, directly combined with SiO 2 , is ideal for implementation in power devices. [ABSTRACT FROM AUTHOR]