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365 results on '"Swaminathan, Madhavan"'

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5. Efficient monostatic anisotropic point scatterer model for high performance computing.

7. A Review of Polymer Dielectrics for Redistribution Layers in Interposers and Package Substrates.

9. Bayesian Learning for Uncertainty Quantification, Optimization, and Inverse Design.

13. Substrate Integrated Waveguide Filters in Glass Interposer for mmWave Applications.

14. Spherical Harmonic-Based Anisotropic Point Scatterer Models for Radar Applications Using Inverse Optimization.

15. Mechanical Characterization of Ultra-Thin, Flexible Glass Substrates for RF Applications.

16. Characterization of Alumina Ribbon Ceramic Substrates for 5G and mm-Wave Applications.

17. Analytical stability condition of the latency insertion method for nonuniform GLC circuits

18. Accurate transient simulation of interconnects characterized by band-limited data with propagation delay enforcement in a modified nodal analysis framework

19. On-chip power-grid simulation using latency insertion method

20. A heterogeneous array of off-chip interconnects for optimum mechanical and electrical performance

21. Air-gap transmission lines on organic substrates for low-loss interconnects

22. Multilayered finite-difference method (MFDM) for modeling of package and printed circuit board planes

23. Statistical analysis and diagnosis methodology for RF circuits in LCP substrates

24. Modeling of power supply noise in large chips using the circuit-based finite-difference time-domain method

25. Layout-level synthesis of RF inductors and filters in LCP substrates for Wi-Fi applications

26. Construction of broadband passive macromodels from frequency data for simulation of distributed interconnect networks

27. A Knowledge Based Method for Optimization of Decoupling Capacitors in Power Delivery Networks.

29. HilbertNet: A Probabilistic Machine Learning Framework for Frequency Response Extrapolation of Electromagnetic Structures.

30. Effect of Titanium-Polymer Interactions on Adhesion of Polymer-Copper Redistribution Layers in Advanced Packaging.

32. Characterization of embedded passives using macromodels in LTCC technology

33. A novel integrated decoupling capacitor for MCM-L technology

34. A novel test technique for MCM substrates

35. Characterization of a small peripheral array package

36. Noise computation in single chip packages

37. Multiphysics Challenges and Opportunities for Integrated Voltage Regulators in Power Delivery Architectures.

38. Embedded Inductors Using Composite Magnetic Materials for 12–1-V Integrated Voltage Regulators.

39. Chiplet/Interposer Co-Design for Power Delivery Network Optimization in Heterogeneous 2.5-D ICs.

40. Proposed Inductor Power Loss Metric and Novel Embedded Toroidal Inductor for Integrated Voltage Regulators.

41. Electrical design of an MCM package for a multi-processor digital system

42. Surface integral formulation for calculating conductor and dielectric losses of various transmission structures

43. Measurement of dielectric anisotropy of BPDA-PDA polyimide in multilayer thin-film packages

44. Design tradeoffs among MCM-C, MCM-D and MCM-D/C technologies

45. Volume/scattering formulation for analyzing scattering from coated periodic strips

46. Integral equation solution for analyzing scattering from one-dimensional periodic coated strips

47. Conductor loss in hollow waveguides using a surface integral formulation

49. Design Space and Frequency Extrapolation: Using Neural Networks.

50. High-density low-loss millimeter-wave package interconnects with the impact of dielectric-material surface roughness.

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