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For the first time, the necessity to thermally pre-treat ubiquitously used PET substrates for printed electronics, to improve dimensional stability during manufacturing, is clearly defined. The experimental results have proven this phenomenon for both roll-to-roll (R2R) and sheet-to-sheet (S2S) processing of printed electronics. The next generation of electronics manufacturing has pushed the boundaries for low-cost, flexible, printed, and mass produced electronic components and systems. A driving force, and enabling production method, are the R2R printing presses. However, to produce electronics with increasing complexity and high yield in volume production, one must have a highly accurate process. In this article, R2R processing accuracy of printed electronics is evaluated from the point of dimensional accuracy of the flexible polyester substrate (DuPont Teijin Films’ PET Melinex ST504 with and without indium tin oxide, Melinex ST506, and Melinex PCS), precision of printing, and accuracy of layer-to-layer registration with stages that involve tension and elevated temperatures. This study has confirmed that dimensional changes during R2R processing will occur only in the first processing stage and that if a thermal pre-treatment run for the substrate is made—at identical temperature and tension of the processing stage—there is improved stability originating from a new-level strain in the crystalline PET film structure and freezing it in at the tensions and temperatures it is exposed to (i.e. 1400 μm machine direction stretching reduced to 8 μm). Furthermore, it is explained how the dimensional accuracy can be improved and reproducibly maintained in multilayer printing of electronics devices such as organic photovoltaics (OPV). These devices provide a valuable baseline of how the layer-to-layer alignment accuracy plays a crucial role in fully printed electronics devices, which lessons can be applied in all aspects of this field including hybrid systems and system fabrication involving multiple processing methods.

Stretchable electronics has attracted much interest recently because of its potential applications in the area of wearable electronics and healthcare. Highly elastic polydimethyl siloxane (PDMS) has been for decades a widely used material in prototyping purposes. It enables the realization of a variety of mechanical and optical functions besides being a substrate for other processes or applications. As a substrate, PDMS enables high stretchability and easy integration of other parts made of PDMS. In this work, we demonstrated a high-volume production of stretchable electrical interconnections on PDMS substrates. We used roll-to-roll (R2R) rotary screen printing that has been conventionally applied in high-throughput fabrication of electronics on flexible, but not stretchable, substrates. We demonstrated silver interconnects whose conductivity remains sufficient for signal transmission, for example, in sensor structures under repeated 20% strain over 100 cycles. We also demonstrated R2R compatible PDMS encapsulation of electrical interconnections that increased the strain repetition durability by a factor of 2.

This paper discusses the modeling of the lifetime of printed conductors on a flexible substrate under cyclic bending. Roll-to-roll printed silver lines on a plastic film were exposed to cyclic strains accordant to the bending radii of 15, 20, and 30 mm, and their long-term electrical behavior was monitored in situ with four-point dc resistance measurements. By using 5%, 10%, and 20% increase in resistance as failure criteria, the lifetime of test populations was assessed utilizing the Weibull reliability analysis. Based on these results, the relationship between the applied strain and the lifetime was characterized and modeled by the Coffin–Manson equation. The Coffin–Manson relation accordant behavior for the lifetimes under various strains was also verified by confirming measurements with untapped bending radii with good results. As a conclusion, the lifetime of a printed conductor with known geometry and materials under cyclic bending was able to be modeled as a function of bending radius with the Coffin–Manson relation.

Novel continuous and mass customizable light-emitting diode (LED) lighting foil system, capable to produce adequate lighting levels for general lighting, was designed, processed, and characterized. Lighting element substrate was processed by roll-to-roll (R2R) printing using silver ink and automatic bonding of LEDs and current regulators on polyethylene terephthalate (PET) substrate using isotropic conductive adhesive (ICA). Demonstrator consisting of two basic lighting elements contained 98 LEDs and produced 860 lm when running with 25 mA operational current through the LEDs when using total electrical driving power of 8.4 W. Measured power conversion efficiency of the demonstrator was 31 % and efficacy 102 lm/W. Element produced 460 lx illumination level measured by an illumination level meter at element's central axis at distance of 1 m. At a distance of 2 m, illumination level was 110 lx, respectively. Temperature measurements with T3Ster thermal characterization instrument showed that when driving LED with maximum nominal driving current of 100 mA, LED junction temperature was about 120 °C, when lighting element was in air in room temperature. Accelerated environmental stress tests consisting of 500 cycles from -40 . +80 °C in aging oven and 1000 h in +60 °C/95 % RH climate chamber were performed to test samples without any failures. In addition, over 700 bending cycles using 20 mm bending radius were performed to test samples without any failures, so bonding of LEDs were shown reliable according to these tests. Achieved results proved that thin, flexible, and large area high luminous flux lighting elements and systems can be processed based on plastic foil manufactured using R2R silver ink printing and R2R automatic bonding of LEDs and regulator components using ICA on that foil.

Despite its potential prognostic value concurrent atrial ischemia is often overlooked in patients with acute myocardial infarction (AMI). There is no study concerning the relationship between atrial coronary circulation and dynamic PR-segment changes in patients with AMI. We evaluated dynamic PR-segment changes in 37 patients with AMI. The flow in the principal atrial coronary branches was diminished in 14 (38%) patients. Dynamic changes in the PR-segment level [median 47 (inter quartile range 19–55) μV vs. 23 (18–30) μV, P = 0.005] and PR-segment area [3.15 (1.75-3.69) nVs vs. 1.62 (1.18-2.04) nVs, P = 0.005] were significantly greater in patients with compromised than in those with normal flow in the atrial coronary branches. Our findings support the concept that atrial ischemia produces similar changes in the PR-segment as ventricular ischemia in the ST-segment. Given the possible deleterious consequences of atrial ischemia these data may have important clinical implications in evaluation of patient with AMI.

A hermetic fiber pigtailed laser module utilizing passive device alignment on a low-temperature cofired ceramics (LTCC) substrate is demonstrated. The 3-D shape of the laminated and cofired ceramic substrate provides the necessary alignment structures, including grooves and cavities, for the laser-to-fiber coupling. When the laser diode chip and component tolerances are tight enough, the passive alignment allows high coupling efficiency realizations of multimode fiber pigtailed laser modules. The ceramic substrate is intrinsically hermetic and it opens up the possibility to use the substrate as an integrated part of the hermetic module package. In our concept hermetic sealing is produced by utilizing a Kovar frame, which is soldered to an LTCC substrate. The Kovar frame has a hole for a fiber feed-through and a hermetic glass-metal seal between fiber and frame is processed using a glass preform. The module can be used as a transmitter in a laser pulse time-of-flight distance sensor and in this application it can be overdriven by a factor of 10. This means that the peak optical power in the pulses can be several dozen watts. The laser chip allows this kind of overdriving, due to the fact that the duty factor in the operation is only 0.0% at 2 kHz pulsing frequency, which leads to an average power of several milliwatts. The simulated nominal coupling efficiency between the 210 mum times 1 mum stripe laser and the 200/220 mum step index fiber (NA = 0.22) was 0.65. The measured coupling efficiency of the hermetically sealed prototypes varied from 0.14 to 0.64, where the average was 0.39. A leak rate of 1 times 10-7 . .. 8 times 10-7 [atm times cm3/s] was measured in the helium leak tests of the final operational prototypes, when the modules were tested according to MIL-STD-883F method 1014.9 specification. The rather high leak rate is mainly due to the helium absorbed by the fiber polymer buffer layer and rubber guard tube in the pressurization process. The leak rate for the dummy modules using a buffer stripped fiber without a rubber guard tube was 3 times 10-9 . .. 1 times 10-8 [atm times cm3/s]. The maximum allowed leak rate for this size of hermetic module is 1 times 10-7 [atm times cm3/s]. The background helium level before and after the tests was less than 3 times 10-10 [atm times cm3/s]. Measurements proved that the manufacturing procedure is capable of producing hermetic fiber pigtailed laser modules.