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An oxygen gas microsensor based on nanostructured sol-gel TiO2 thin films with a buried Pd layer was developed on a silicon substrate. The nanostructured titania thin films for O2 sensors were prepared by the sol-gel process and became anatase after heat treatment. A sandwich TiO2 square board with an area of 350 μm × 350 μm was defined by both wet etching and dry etching processes and the wet one was applied in the final process due to its advantages of easy control for the final structure. A pair of 150 nm Pt micro interdigitated electrodes with 50 nm Ti buffer layer was fabricated on the board by a lift-off process. The sensor chip was tested in a furnace with changing the O2 concentration from 1.0% to 20% by monitoring its electrical resistance. Results showed that after several testing cycles the sensor’s output becomes stable, and its sensitivity is 0.054 with deviation 2.65 × 10−4 and hysteresis is 8.5%. Due to its simple fabrication process, the sensor has potential for application in environmental monitoring, where lower power consumption and small size are required.

Our previous report based on a 10 g (gravity) silicon-based inertial micro-switch showed that the contact effect between the two electrodes can be improved by squeeze-film damping. As an extended study toward its potential applications, the switch with a large proof mass suspended by four flexible serpentine springs was redesigned to achieve 5 g threshold value and enhanced threshold accuracy. The impact of the squeeze-film damping on the threshold value was theoretically studied. The theoretical results show that the threshold variation from the designed value due to fabrication errors can be reduced by optimizing the device thickness (the thickness of the proof mass and springs) and then establishing a tradeoff between the damping and elastic forces, thus improving the threshold accuracy. The design strategy was verified by FEM (finite-element-method) simulation and an experimental test. The simulation results show that the maximum threshold deviation was only 0.15 g, when the device thickness variation range was 16⁻24 μm, which is an adequately wide latitude for the current bulk silicon micromachining technology. The measured threshold values were 4.9⁻5.8 g and the device thicknesses were 18.2⁻22.5 μm, agreeing well with the simulation results. The measured contact time was 50 μs which is also in good agreement with our previous work.

An oxygen gas microsensor based on nanostructured sol-gel TiO2 thin films with a buried Pd layer was developed on a silicon substrate. The nanostructured titania thin films for O2 sensors were prepared by the sol-gel process and became anatase after heat treatment. A sandwich TiO2 square board with an area of 350 µm x 350 µm was defined by both wet etching and dry etching processes and the wet one was applied in the final process due to its advantages of easy control for the final structure. A pair of 150 nm Pt micro interdigitated electrodes with 50 nm Ti buffer layer was fabricated on the board by a lift-off process. The sensor chip was tested in a furnace with changing the O2 concentration from 1.0% to 20% by monitoring its electrical resistance. Results showed that after several testing cycles the sensor's output becomes stable, and its sensitivity is 0.054 with deviation 2.65 x 10-4 and hysteresis is 8.5%. Due to its simple fabrication process, the sensor has potential for application in environmental monitoring, where lower power consumption and small size are required. [ABSTRACT FROM AUTHOR]

Abstract: We have developed an MEMS-based Pd membrane microreactor for one-step conversion of benzene to phenol, and also evaluated the H2 permeation characteristics through the Pd membrane before the benzene hydroxylation experiments. The conversion of benzene, selectivity and yield of phenol were investigated by varying the operation conditions. The phenol yield of 20% and benzene conversion of 54% were obtained at a reaction temperature of 200°C. The phenol and dihydric phenols dominated the distribution of products and the hydrogenation products of from benzene and phenol were absent in the MEMS-based Pd membrane microreactor, which was very different from the macrotubular Pd membrane reactors. The effect of H2/O2 ratio on products distribution has been investigated. From the comparison of reaction results with a macrotubular Pd membrane reactor, it is figured out that the Pd membrane microreactors fabricated by MEMS technology gave a higher reaction conversion and product yield. [Copyright &y& Elsevier]

Inertial micro-switches have great potential in the applications of acceleration sensing, due to the integrated advantages of a small size, high integration level, and low or even no power consumption. This paper presents an overview of the recent advancements made in research on the sensitive direction, threshold acceleration, contact effect, and threshold accuracy of inertial micro-switches. The reviewed switches were categorized according to the performance parameters, including multi-directional switches, multi-threshold switches, persistent closed switches, flexible-electrode switches, and low-g high-threshold-accuracy switches. The current challenges and prospects are also discussed. [ABSTRACT FROM AUTHOR]

Our previous report based on a 10 g (gravity) silicon-based inertial micro-switch showed that the contact effect between the two electrodes can be improved by squeeze-film damping. As an extended study toward its potential applications, the switch with a large proof mass suspended by four flexible serpentine springs was redesigned to achieve 5 g threshold value and enhanced threshold accuracy. The impact of the squeeze-film damping on the threshold value was theoretically studied. The theoretical results show that the threshold variation from the designed value due to fabrication errors can be reduced by optimizing the device thickness (the thickness of the proof mass and springs) and then establishing a tradeoff between the damping and elastic forces, thus improving the threshold accuracy. The design strategy was verified by FEM (finite-element-method) simulation and an experimental test. The simulation results show that the maximum threshold deviation was only 0.15 g, when the device thickness variation range was 16–24 μm, which is an adequately wide latitude for the current bulk silicon micromachining technology. The measured threshold values were 4.9–5.8 g and the device thicknesses were 18.2–22.5 μm, agreeing well with the simulation results. The measured contact time was 50 μs which is also in good agreement with our previous work. [ABSTRACT FROM AUTHOR]