1. Process impact of mask grid variation
- Author
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Paul van der Vleuten, Arjan Verhappen, Martin Chaplin, Lloyd C. Litt, Jan Pieter Kuijten, Stephan van der Goor, Will Conley, and Bryan S. Kasprowicz
- Subjects
business.industry ,Computer science ,Acoustics ,Rounding ,media_common.quotation_subject ,Fidelity ,Ranging ,Condensed Matter Physics ,Grid ,Atomic and Molecular Physics, and Optics ,Surfaces, Coatings and Films ,Electronic, Optical and Magnetic Materials ,Numerical aperture ,Optics ,Optical proximity correction ,Electrical and Electronic Engineering ,business ,media_common - Abstract
This paper will focus on the process impact of the intentional change in the mask writing grid. Grids ranging from 1nm to 4nm (defined at mask level) were used to investigate the effect on test structures in critical locations. The impact on optical proximity correction (OPC) to control line end pull back, corner rounding and general image fidelity will be investigated on >1 numerical aperture (NA) immersion imaging system.
- Published
- 2007
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