Search

Your search keyword '"Lee, Chang-Chun"' showing total 202 results
Start Over Author "Lee, Chang-Chun" Search Limiters Peer Reviewed
202 results on '"Lee, Chang-Chun"'

1. Vaccination induces broadly neutralizing antibody precursors to HIV gp41

Author

Schiffner, Torben, Phung, Ivy, Ray, Rashmi, Irimia, Adriana, Tian, Ming, Swanson, Olivia, Lee, Jeong Hyun, Lee, Chang-Chun D., Marina-Zárate, Ester, Cho, So Yeon, Huang, Jiachen, Ozorowski, Gabriel, Skog, Patrick D., Serra, Andreia M., Rantalainen, Kimmo, Allen, Joel D., Baboo, Sabyasachi, Rodriguez, Oscar L., Himansu, Sunny, Zhou, Jianfu, Hurtado, Jonathan, Flynn, Claudia T., McKenney, Katherine, Havenar-Daughton, Colin, Saha, Swati, Shields, Kaitlyn, Schultze, Steven, Smith, Melissa L., Liang, Chi-Hui, Toy, Laura, Pecetta, Simone, Lin, Ying-Cing, Willis, Jordan R., Sesterhenn, Fabian, Kulp, Daniel W., Hu, Xiaozhen, Cottrell, Christopher A., Zhou, Xiaoya, Ruiz, Jennifer, Wang, Xuesong, Nair, Usha, Kirsch, Kathrin H., Cheng, Hwei-Ling, Davis, Jillian, Kalyuzhniy, Oleksandr, Liguori, Alessia, Diedrich, Jolene K., Ngo, Julia T., Lewis, Vanessa, Phelps, Nicole, Tingle, Ryan D., Spencer, Skye, Georgeson, Erik, Adachi, Yumiko, Kubitz, Michael, Eskandarzadeh, Saman, Elsliger, Marc A., Amara, Rama R., Landais, Elise, Briney, Bryan, Burton, Dennis R., Carnathan, Diane G., Silvestri, Guido, Watson, Corey T., Yates, III, John R., Paulson, James C., Crispin, Max, Grigoryan, Gevorg, Ward, Andrew B., Sok, Devin, Alt, Frederick W., Wilson, Ian A., Batista, Facundo D., Crotty, Shane, and Schief, William R.

Published
2024
Full Text
View/download PDF

2. Affinity gaps among B cells in germinal centers drive the selection of MPER precursors

Author

Ray, Rashmi, Schiffner, Torben, Wang, Xuesong, Yan, Yu, Rantalainen, Kimmo, Lee, Chang-Chun David, Parikh, Shivang, Reyes, Raphael A., Dale, Gordon A., Lin, Ying-Cing, Pecetta, Simone, Giguere, Sophie, Swanson, Olivia, Kratochvil, Sven, Melzi, Eleonora, Phung, Ivy, Madungwe, Lisa, Kalyuzhniy, Oleksandr, Warner, John, Weldon, Stephanie R., Tingle, Ryan, Lamperti, Edward, Kirsch, Kathrin H., Phelps, Nicole, Georgeson, Erik, Adachi, Yumiko, Kubitz, Michael, Nair, Usha, Crotty, Shane, Wilson, Ian A., Schief, William R., and Batista, Facundo D.

Published
2024
Full Text
View/download PDF

27. Influenza A surface glycosylation and vaccine design

Author

Wu, Chung-Yi, Lin, Chih-Wei, Tsai, Tsung-I, Lee, Chang-Chun David, Chuang, Hong-Yang, Chen, Jhih-Bin, Tsai, Ming-Hung, Chen, Bo-Rui, Lo, Pei-Wen, Liu, Chiu-Ping, Shivatare, Vidya S., and Wong, Chi-Huey

Published
2017

40. Layout Dependence Stress Investigation in through Glass via Interposer Architecture Using a Submodeling Simulation Technique and a Factorial Design Approach.

Author

Wang, Shih-Hung, Hsu, Wensyang, Liou, Yan-Yu, Huang, Pei-Chen, and Lee, Chang-Chun

Subjects
FACTORIAL experiment designs, FACTORIALS, SIMULATION methods & models, FINITE element method, DESIGN techniques, EPOXY compounds
Abstract

The multi-chiplet technique is expected to be a promising solution to achieve high-density system integration with low power consumption and high usage ratio. This technique can be integrated with a glass interposer to accomplish a competitive low fabrication cost compared with the silicon-based interposer architecture. In this study, process-oriented stress simulation is performed by the element activation and deactivation technique in finite element analysis architecture. The submodeling technique is also utilized to mostly conquer the scale mismatch and difficulty in mesh gridding design. It is also used to analyze the thermomechanical responses of glass interposers with chiplet arrangements and capped epoxy molding compounds (EMC) during curing. A three-factor, three-level full factorial design is applied using the analysis of variance method to explore the significance of various structural design parameters for stress generation. Analytic results reveal that the maximum first principal stresses of 130.75 and 17.18 MPa are introduced on the sidewall of Cu-filled via and the bottom of the glass interposer, respectively. Moreover, the EMC thickness and through glass via pitch are the dominant factors in the adopted vehicle. They significantly influence the stress magnitude during heating and cooling. [ABSTRACT FROM AUTHOR]

Published
2023
Full Text
View/download PDF

49. Microscopic mechanical simulation and experimental demonstration of deformed-induced failure for Li-ion battery package in electric vehicle.

Author

Lee, Chang-Chun, Hsiang, Te-Pei, Chang, Wen-Hsuan, and Lee, Ming-Tsang

Subjects
*ELECTRIC vehicle batteries, *LITHIUM-ion batteries, *STEEL fracture, *FINITE element method, *CARBON steel
Abstract

A microscopic finite element model validated by the quasi-static mechanical test on lithium ion battery cell is presented in this study. The investigated condition involves three-point bending and cell discharge test, which include the mechanical response and thermal response of lithium ion battery cell. The cell is investigated through computational simulation. Results show great correlation between the experiment and finite element simulation. A microscopic model requires a greater effort during simulation. Investigating the fracture on steel casing and cell core is possible by considering the fracture mechanism in steel shell and jelly roll. The classic von-Mises criterion is applied to predict the failure of carbon steel shell, and the maximum von-Mises strain criterion is used to investigate the jelly roll region. On the basis of the verified battery cell model, battery package with microscopic model, including cell core (cathode, anode, and separator) is constructed to analyze the mechanical response of battery pack. The von-Mises criterion is used to predict the fracture point location of the battery pack with various packing modes and packing densities. [ABSTRACT FROM AUTHOR]

Published
2023
Full Text
View/download PDF

Catalog

Books, media, physical & digital resources
See catalog results