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As a rapidly growing field, biophotonics demonstrates an increasingly higher demand for interdisciplinary professionals and requires the implementation of a structured approach to educational and outreach activities focused on appropriate curriculum, and teaching and learning for audiences with diverse technical backgrounds and learning styles. Our study shows the main findings upon applying this approach to biophotonics workshops delivered 2 consecutive years while updating and improving learning outcomes, teaching strategies, workshop content based on student and teacher feedback. We provided resources for a variety of lecture‐based, experimental, computer simulation activities. Quality of subject matter, teaching, and overall learning was rated as "Very good" or "Good" by 88%, 76%, and 82% of students in average, respectively. Application of our teaching strategies and materials during short‐ and long‐term workshops/courses could potentially increase the interest in pursuing careers in the biophotonics field and related areas, leading to standardized approaches in designing education and outreach events across centers. [ABSTRACT FROM AUTHOR]

Widespread adoption of silicon photonics into datacenters requires that the integration of the driving electronics with the photonics be an essential component of transceiver development. In this article, we describe our silicon photonic transceiver design: a 2.5D integrated multi-chip module (MCM) for 4-channel wavelength division multiplexed (WDM) microdisk modulation targeting 10 Gbps per channel. A silicon interposer is used to provide connectivity between the photonic integrated circuit (PIC) and the commercial transimpedance amplifiers (TIAs). Error free modulation is demonstrated at 10 Gbps with −16 dBm received power for the photonic bare die and at 6 Gbps with −15 dBm received power for the first iteration of the MCM transceiver. In this context, we outline the different integration approaches currently being employed to interface between electronics and photonics—monolithic, 2D, 3D, and 2.5D—and discuss their tradeoffs. Notable demonstrations of the various integration architectures are highlighted. Finally, we address the scalability of the architecture and highlight a subsequent prototype employing custom electronic integrated circuits (EICs). [ABSTRACT FROM AUTHOR]