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We report on the flip chip packaging of Micro-Electro-Mechanical System (MEMS)-based digital silicon photonic switching device and the characterization results of 12 × 12 switching ports. The challenges in packaging N 2 electrical and 2N optical interconnections are addressed with single-layer electrical redistribution lines of 25 μm line width and space on aluminum nitride interposer and 13° polished 64-channel lidless fiber array (FA) with a pitch of 127 μm. 50 μm diameter solder spheres are laser-jetted onto the electrical bond pads surrounded by suspended MEMS actuators on the device before fluxless flip-chip bonding. A lidless FA is finally coupled near-vertically onto the device gratings using a 6-degree-of-freedom (6-DOF) alignment system. Fiber-to-grating coupler loss of 4.25 dB/facet, 10–11 bit error rate (BER) through the longest optical path, and 0.4 μs switch reconfiguration time have been demonstrated using 10 Gb/s Ethernet data stream. [ABSTRACT FROM PUBLISHER]

In this paper, a 3-D integrated 77-GHz automotive radar front-end is presented. Embedded wafer level packaging (EMWLP) technology is proposed to eliminate the use of wire bonding, which not only introduces significant radio frequency loss, but also occupies large footprint for high-pin count die. The transceiver bare die is embedded in a reconfigured molded wafer with compression molding process. Double-sided multiple redistribution layers are formed to fan-out the transceiver input/output signals and through mold via is employed to realize the vertical interconnection. With these promising features, the EMWLP technology can be extended to a 3-D integration. A substrate integrated waveguide slot antenna is integrated on top of the EMWLP module and a lens is used to enhance the antenna directivity. The performance of the fully integrated radar front-end is tested and the measurement results show good package performance with RF loss around 5 dB for most of the samples. Temperature cycling reliability test was also performed by letting the fully integrated prototype goes through 1000 temperature cycles with JEDEC standard. The measured package loss spread across samples after 1000 cycles of TC test is about 13 dB, which is mainly due to the antenna warpage affecting the RF path's signal integrity. [ABSTRACT FROM AUTHOR]