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In this article the author talks about the Evaluation Engineering provides a snapshot of the responsibilities of leaders have, about determining their job satisfaction, and overall thoughts on their compensation. It mentions that the results of all questions with all respondents, the vast majority of this year's survey results will compare engineers only against other engineers, managers only against other managers, and so on.

The article discusses the importance of semiconductor tests for electronic devices. Topics discussed include technologies such as Cloud, artificial intelligence, and the onset of 5G; views of Rob Knoth, product management director, Digital Staff Group at Cadence Design Systems; and the suggestions for GENASYS Semi TS-960 Series from Marvin Test Solutions.

The article presents the outlook of several electronic test and measurement solution providers on trends in radio frequency (RF)/microwave testing and fifth generation (5G) wireless connectivity. Topics covered include challenge of making fast and effective temperature profile of a product according to Jon Booher of Total Temp Technologies, increase in 5G FR1 test requirements according to Mike Thorpe of Rohde & Schwarz USA and areas of focus among vendors.

The article focuses on trends and new products in data acquisition systems (DAQs) according to suppliers. Topics covered include need for faster data capture rates and real-time analysis among design and development managers, according to Yusuf Chitalwala of Yokogawa, challenges facing suppliers in developing innovations in DAQs, according to Peter Anderson of Measurement Computing and features that customers are asking vendors to provide, according to Bernard Ang of Keysight Technologies.

The article focuses on the use of benchtop instruments to improve the capabilities of modular instruments. It offers information on equivalent test system that can be developed by inserting instrument modules into one chassis. It mentions that modular instruments market rose to 1.12 billion dollars and expected to double by 2023 to 2.11 billion dollars.

The article discusses trends and challenges faced by power semiconductor test vendors, which involves power semiconductors, silicon carbide (SiC) and gallium nitride (GaN) transistors. It mentions views of John Booher, from Total Temp Technologies, on Test equipment and power consumption. It mentions views of Mark Cejer, marketing director at Tektronix/Keithley Instruments, on automobile and industrial applications.

The article focuses on programmable power supplies and loads. Topics discussed include generating generation power supplies from Elektro-Automatik are high switching frequency (150kHz) SiC MOSFET amplifers, benefits of wide bandgap, SiC, and GaN-based devices, and products available include PS9000 from Elektro-Automatik (EA), 2230G series from Tektronix and Asterion from Ametek for DC power.

The article focuses on pressure on manufacturers of switching systems due to rise of intelligent factories, smart cities and internet of things (IoT) to adapt instrument for application based on connectivity. Topics discussed include proliferation of electronic control units (ECUs) across electronic industries, views of John Brown, application engineer at measurement device manufacturer Tektronix, on acquisition of data and migration of switching systems to cableless interfaces.

The article looks at the trends in vector network analyzers (VNA) according to some leading electronic test and measurement instrument vendors. These include lower-cost VNA instrumentation with enough flexibility to perform critical radio frequency measurements like spectrum analysis and monitoring, more channels for developing MIMO antennas and phase arrays, and higher frequency requirements driven by new applications.

The article looks at the trends in high-speed digital test for 2019. These include tighter limits for overall system jitter as the data rates in high-speed digital designs increase, vector network analyzers replacing traditional time domain reflectometry setups for testing passive components such as cables, connectors and printec circuit boards, and multiport instruments. Other trends include the need for larger networks for the cloud providers, and lower power consumption in many devices.

In this article the author talks about optical communications technology will remain a crucial counterpart to wireless RF, as considerable advancements in optical system capacity, network reach, and user base size make it an attractive commercial solution. It mentions that the Optical wireless communication systems are attractive as a broadband access technology due to their high speeds, and the cost-effectiveness of meeting bandwidth requirements of different services.

The article offers information on the fields of electromagnetic interference (EMI), and electromagnetic compatibility (EMC) testing. It notes that the tests provide measurements, debugging, precompliance, and full compliance testing for a wide variety of electronics. It discusses the importance of EMI/EMC testing in a product's lifecycle.

The article offers information on the company Tempo Automation which is focused on building robots that build PCB assemblies before pivoting to creating its factory automation software. It mentions views of Jeff McAlvay of Tempo Automation, on software-centric approach of Tempo Automation. It presents information on the Tempo's Automatic Pick and Place Machine Programming software.

The article focuses on technological innovation in electronic medical test which has continued to enable engineers to innovate medical equipment such as wearable devises and apps. Topics discussed include Averna Technologies, a provider of automated test solution, which elaborated procedures into testing of electronic medical devices, smart injectors being developed by companies and silico apporach investigated by U.S. Food and Drug Administration (FDA).

An interview with senior strategist for signal processing applications at MathWorks, Ken Karnofsky. Topics discussed include his views on the relationship between wireless testing and simulation; his thoughts on complexity of wireless communication standards; and on the challenges companies can face in terms of designing next generation communication systems.

The article presents the discussion on cybersecurity. It states that cybersecurity is a priority for vendors of electronic test and measurement instruments. It mentions that for box instrumentation, one of the important concerns for end users is the breach of cybersecurity through an infected instrument.

The article focuses on the predictions of Tom Cameron, director of wireless technology of Analog Devices, and Ian Campbell, chief executive officer of OnScale, for 5G networks in 2019. Campbell says that the mobile applications of 5G technology are still a few years away due to the disconnect between 5G network availability and the devices that must be created to exist on that network. Cameron says that 5G will have low penetration in 2019 but will accelerate in the coming years.

Statistics are given regarding the increase in North American PCB shipments in June, year-over-year; and the number of Square inches of worldwide silicon wafer area shipments in Q2 2019.

In this article the author talks about similar job and salary reports for several other publications before favorite part of them is always the open-ended feedback when respondents are asked to anonymously share their thoughts on their salary or compensation.

The editor offers information about his article focused on brain drain in electronic test engineering that was published in the April, 2019 issue. Topics discussed include the challenge institutions are facing to find quality test engineers; retirement of baby-boomer aged engineers who are very experienced; and the test solutions that offer large, touch-screen displays making it easier for new test engineers to get up-to-speed quickly.

The author emphasizes the need for research aimed at determining whether fifth generation (5G) of wireless connectivity is safe or unsafe to the human body. Topics covered include role of exposure to radiation in higher risk of various cancers and other ailments, possible carcinogenicity of the radio frequency (RF) electromagnetic radiation from cellphones, and outlook of Jerrold Bushberg, clinical professor of radiology and radiation oncology, on health risk of radio frequency energy.

An introduction to the journal is presented in which the editor discusses various reports in the issue on the topics including one on 5G wireless networks in Chicago and Minneapolis, the 5G carrier from Verizon Communications Inc. in the U.S. and 5G smartphones and WiFi 6-equipped hotspots.

In this article, the author discusses talent gap and others challenges faced in electronic test engineering. It mentions information on challenges faced by engineering firms in recruiting test engineers. It presents information on the International Test Conference in Phoenix, Arizona, which involved discussions regarding interest of engineering students in software engineering.

The article focuses on the advent of 5G communication technology, and talks of 5G network infrastructure advertised by communication company Verizon, and growth of shared communications infrastructure provider Crown Castle.

The article focuses on industrial robot arm supplier Universal Robots which celebrated anniversary of delivering robots and mentions cobots used by home textile firm Lanatex from Universal Robots. Topics discussed include how cobots increase productivity level of businesses that deploy them, International Manufacturing Technology Symposium show in Chicago and safety features in robot such as sensors.

The article focuses on the Martian mission of the U.S. National Aeronautics & Space Administration's InSight Rover, which landed on Mars on November 26, 2018. The rover sent its first image from the Martian surface just a few minutes after touchdown. InSight's instruments will be deployed as part of its two-year mission of burrowing a heat probe and performing a series of radio experiments to study the internal structure and rotation of the planet.