Search

In order to enhance the ignition ability and reliability of traditional electronic initiators, a novel electronic initiator has been designed to integrate with a nanothermite multilayer film and an electrode plug. The Al/CuOx nanothermite multilayer film with different thickness is deposited on the surface of the electrode plug by magnetron sputtering which uses Pt–W wire as electronic resistance. The exothermicity of Al/CuOx nanothermite multilayer film is so favourable that the ignition ability of electronic initiator is significantly improved. The full firing-voltage sensitivity of the electronic initiator is 10.8 V. The thickness of Al/CuOx multilayer film has negligible effects on the ignition time and ignition energy, but leads to great impacts on the function time, the maximum length of combustion flame and ignition ability. The electrical ignition experiments have exhibited outstanding ignition ability, since the electronic initiator can easily fire the insensitive ignition composition of boron-potassium nitrate (B-KNO3) tablet in a gap of 20.35 mm. It proves that this novel proposal of remoulding the traditional electronic ignition devices will distinctly improve the ignition ability and reliability of electronic initiator.

In this study, CoFe2O4 is selected for the first time to synthesize CoFe2O4/Al nanothermite films via an integration of nano-Al with CoFe2O4 nanowires (NWs), which can be prepared through a facile hydrothermal-annealing route. The resulting nanothermite film demonstrates a homogeneous structure and an intense contact between the Al and CoFe2O4 NWs at the nanoscale. In addition, both thermal analysis and laser ignition test reveal the superb energetic performances of the prepared CoFe2O4/Al NWs nanothermite film. Within different thicknesses of nano-Al for the CoFe2O4/Al NWs nanothermite films investigated here, the maximum heat output has reached as great as 2100 J·g−1 at the optimal thickness of 400 nm for deposited Al. Moreover, the fabrication strategy for CoFe2O4/Al NWs is also easy and suitable for diverse thermite systems based upon other composite metal oxides, such as MnCo2O4 and NiCo2O4. Importantly, this method has the featured advantages of simple operation and compatibility with microsystems, both of which may further facilitate potential applications for functional energetic chips.

In this study, a new method was reported for the fabrication of the nanostructured CuO/Al thermite film on a Cu substrate. The CuO nanorod (NR) arrays grew vertically from the Cu surfaces by electrochemical anodization processes, followed by the deposition of an Al layer on the CuO NRs via magnetron sputtering to form a core/shell CuO/Al nanothermite film, whose component, structure and morphology were subsequently characterized. In addition, the energy-release characteristics of the obtained nanothermite film were investigated using thermal analyses and laser ignition tests. All evidence demonstrates that the obtained CuO/Al is of a uniform structure and has superb energy performance. Impressively, the resulting material is potentially useful in applications of functional energetic chips due to its easy integration with microelectromechanical systems (MEMS) technologies. [ABSTRACT FROM AUTHOR]