1. WORLDWIDE HIGHLIGHTS.
- Subjects
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METROLOGY , *FLIP chip technology , *PHOTOMASK manufacturing - Abstract
The article offers information related to the technologies industry. It states that SEMATECH Inc. developed a new three dimensional (3D) Enablement program which targets standards in inspection, metrology, and die handling. It mentions that Carl Zeiss SMS GmbH is partnering with Synopsys Inc. to establish an in-die registration metrology to be used for photomask manufacturing. It adds that Fujitsu Semiconductor Ltd. will shift its flip chip mounting technology into a group affiliate in China.
- Published
- 2011