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2. Temperature Distribution Research on Liquid Packaging Structure of Deep UV LEDs.

Author

Xia, Zhenghao, Wen, Zuojie, Li, Bingqian, Wang, Fei, and Zhang, Daming

Subjects
*TEMPERATURE distribution, *PACKAGING materials, *PETROLEUM distribution, *SEALING devices, *PACKAGING, *LIGHT sources, *THERMAL conductivity
Abstract

By showing a packaged device model with 2 × 2 chips, the effects of packaging material, device height, chip spacing, thermal conductivity, and viscosity of silicone oil on temperature distribution of deep ultraviolet (UV) light-emitting diodes (LEDs) were investigated by finite element simulation. The results showed that similar temperature distributions in the horizontal and vertical directions were obtained using different packaging materials including gas, solid, and liquid. The lowest maximum temperature (131.7°C) was obtained with liquid packaging compared to the gas packaging (140.8°C) and solid packing (132.5°C). Accompanied by increasing the device height, the maximum temperature of the liquid packaging structure revealed a more significant drop compared to solid packaging. However, that of gas packaging exhibited a rise and saturation. Larger chip spacing and higher thermal conductivity of silicone oil will dramatically reduce the maximum temperature of the liquid packaging device, and a lower maximum temperature and more uniform temperature distribution were obtained by using a lower viscosity packaging material. Therefore, considering the feasibility of the device process, appropriate liquid packaging structures can be optimized, and the maximum temperature of the liquid packaging structure of 102.8°C has been achieved. Liquid packaging may have a certain impact on the reliability of device sealing due to the current immature technology. For high-power light sources, there may also be a certain impact on their lifespan. [ABSTRACT FROM AUTHOR]

Published
2023
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3. Design of Embryo-electronic Systems Capable of Self-diagnosing and Self-healing and Configuration Control

Author

Xu Guili, Xia Zhenghao, Wang Haibin, Zhang Zhai, and Wang You-ren

Subjects
Structure (mathematical logic), fault-tolerant, dynamic reconfiguration, Computer science, business.industry, Mechanical Engineering, Reliability (computer networking), Aerospace Engineering, Fault tolerance, aerospace vehicle, embryonic systems, configuration control, Realizability, Embedded system, Self-healing, Electronic engineering, Static random-access memory, Field-programmable gate array, business, Aerospace
Abstract

As aerospace vehicles travel in a hellish environment, the reliability of the measuring and controlling systems has played a critical role in the credibility of a whole airborne system. Embryo-electronic system is a bionic hardware capable of self-diag- nosing and self-healing. This article presents a new approach to design embryo-electronic systems and introduces their bionic principles, system structures and fault-tolerant mechanism. As the current methods cannot meet the requirements for large-scale embryo-electronic systems, this article advances a new shift-register-based configuration memory of embryonic system to solve the problem by using the inter-cell communication to reduce the gene storage capacity of a single cell. The article designs an overall structure of the shift-register-based configuration memories of the embryonic system and connects them into a chain structure. The article also designs an inner circuit of the cell, the control of shift-register-based configuration memory and the way of runtime dynamic configuration. The simulation of field programmable gate array (FPGA) evidences the realizability of the proposed design. Compared to the SRAM-based one, this memory can save 90% of the area when constructing embryonic systems larger than 128 × 128 under the same condition.

Published
2009

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