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For high-volume production of 3D-stacked chips with through-silicon-vias (TSVs), wafer-scale bonding offers lower production cost compared with bump bond technology and is promising for interconnect pitches smaller than 5 µ using available tooling. Prior work has presented wafer-scale integration with tungsten TSV for low-power applications. This paper reports the first use of low-temperature oxide bonding and copper TSV to stack high performance cache cores manufactured in 45 nm Silicon On Insulator-Complementary Metal Oxide Semiconductor (SOI-CMOS) embedded DRAM (EDRAM) having 12 to 13 copper wiring levels per strata and upto 11000 TSVs at 13 µm pitch for power and signal delivery. The wafers are thinned to 13 µm using grind polish and etch. TSVs are defined post bonding and thinning using conventional alignment techniques. Up to four additional metal levels are formed post bonding and TSV definition. A key feature of this process is its compatibility with the existing high performance POWER7™ EDRAM core requiring neither modification of the existing CMOS fabrication process nor re-design since the TSV RC characteristic is similar to typical 100–200 µm length wiring load enabling 3D macro-to-macro signaling without additional buffering Hardware measurements show no significant impact on device drive and off-current. Functional test at wafer level confirms 2.1 GHz 3D stacked EDRAM operation.

This study explores the reliability of a wireless sensing unit by testing it in a real-world university laboratory environment. The unit employs off-the-shelf products for their key components, while a flexible payload scheme was adopted for radio packet transmission to maximize throughput and minimize latency. The testing consists of two main parts: (1) a series of loopback tests using two off-the-shelf radio components with carrier frequencies of 900 MHz and 2.4 GHz, respectively, and (2) wireless transmission of a shake table response to a periodic swept sine excitation. The performance of the wireless channel is examined in each part of the study. Through this experimental investigation, it is validated that a loopback test may be used as a fast prototyping approach to characterize the complex transmitting environment of a structure in which a wireless monitoring system is installed. Various factors leading to signal attenuation are ranked according to their effects on packet delivery performance. Transmitting range and building materials are among the leading factors causing packet loss (and therefore data loss) in this specific testing environment. The severity of interference from 802.11b wireless systems in close proximity to the wireless sensing unit was investigated. Some preliminary results on the influence of operating rotating machinery and human activities are to wireless sensors were investigated. The results presented herein offer a guideline for applying wireless sensing within real-world structures so that the reliability of the wireless monitoring system is maximized. Due to uncertainties associated with the reliability of wireless communications, statistical analysis is performed on the collected time histories to reveal the underlying patterns associated with data loss. Temporal correlations of data loss were measured and found to be related to the adopted radio. A statistical distribution of the size of consecutive lost data points was further derived from the collected data. Such results have identified the need to further develop: (1) reliable communication protocols to reduce these losses in data and information, and (2) robust data processing and system identification tools to anticipate and explicitly handle any data loss. Copyright © 2007 John Wiley & Sons, Ltd.

This paper presents the preliminary findings of a study on data and system identification results (derived from collected data) in a wireless sensing environment. The goal of this study is to understand how various hardware design choices and operational conditions affect the quality of the data and accuracy of the identified results; the focus of this paper is packet and data loss. A series of experimental investigations are carried out using a laboratory shaking table instrumented with off-the-shelf Micro-Electro-Mechanical Systems (MEMS) accelerometers. A wireless sensing unit is developed to interface with these wired analog accelerometers to enable wireless data transmission. To reduce the overall design variance and aid convenient application in civil infrastructure health monitoring, this wireless unit is built with off-the-shelf microcontroller and radio development boards. The anti-aliasing filter and analog-to-digital convectors (ADC) are the only customized components in the hardware. By varying critical hardware configurations, including using analog accelerometers of different commercial brands, taking various designs for the anti-aliasing filter, and adopting ADCs with different resolutions, shaking table tests are repeated, the collected data are processed, and the results are compared. Operational conditions such as sampling rate and wireless data transmitting range are also altered separately in the repeated testing. In all of the cases tested, data is also collected using a wire-based data acquisition system to serve as a performance baseline for evaluation of the wireless data transmission performance. Based on this study, the challenges in the hardware design of wireless sensing units and data processing are identified.© (2005) COPYRIGHT SPIE--The International Society for Optical Engineering. Downloading of the abstract is permitted for personal use only.