Search

For a successful commercialization of microbolometer, it is required to develop a robust package including thermal stabilizingmechanism. In order to regulate the temperature within some operating range, thermoelectric cooler is generally used but it's not easy tomodel the whole package due to the coupled physics nature of thermoelectric cooler. In this paper, SPICE-compatible modelingmethodology of a microbolometer package is presented, whose steady-state results matched well with FEM results at the maximumdifference of 5.95%. Although the time constant difference was considerable as 15.7%, it can be offset by the quite short simulation timecompared to FEM simulation. The developed model was also proven to be useful for designing the thermal stabilizer through parametricand transient analyses under the various working conditions. Keywords : Microbolometer, Thermoelectric cooler, MEMS, package, SPICE ² yx u ¶ h y Ý ×± o Ÿ AD“ ÞN ‹ Š ™  š5 ý N y : ×x u ¶8 Ž Þ Ý x ™ A± o ŸI ¹ × @ A ( I > Þ Þ Š E – ˜ × O O A ² ( ™ I > Þ Þ i ×b|IS ¯ µ Ž5 ý F7 E ³ i P EII ¯Ž i `d h y ×WD z ?I U ¹ × : z ? 'x u ¶ h y Ý × z ? ' h y Ý A : c ? Þ7 i × „ ¯NN E z ? Ý O 3 > a × ƒ Ý w > O ; Š u a > z : ? Þ aDI| \ x ™ A m O ‰ D W 2 0 × N aD i ¨ a ý O=I : ŠS i ´xK : z ? h y ÝK CI u ý ý · ×Q Žx u ¶Z u A n 2 a ( š % —I AD aw ae SDw ae o 3 > c š › S 3 h y Þ × ×WI Ý x ™ A i 2 K \ ýK cw ae SD a ( > o ÞN ‹ ( þ,N Þ × jI R o Þ i ÞN E *D : z ? h y Ý A ² × E Þ >N K \ AD cw ae SD a ( o > E ¤ a uS i bw w ae SDw ae G8 x n Þ Ý$ c x )Ox% ý 30*$ 3FBE 0VU *OUFHSBUFE $JSDVJU ý K > : × AI ¯ y ( ×± E I AD c h y ×WD a ( 3 š % & uS i ˜ a CI u ý ý · u D a ( ƒI h y ×W 3 D Þ 1 ŠS ×  N 3 > c h y ×W Ay o : ¯ a ( o 3 E ¤ & uS i I Þ a Ý ¤ a ( o × u (D a ( A ² 3b 1 Þ b ax u ¶IQ Ž :N ‹ × Ý³ h y ×W 3b 1 Þ Ex u ¶Q Ž i – ™ a dD a ( ƒ8 } a B Þ ŠI 3 ® a5 ý DL c ~ a uS i ÞN E I Þ a N ' AD c d a ( 3 ݳ5 ýx u ¶Z u A n 2 a ( o Ý E8 Š ð Þ × ƒ mg uS × ™ > a ( 0I AD a I o ™I i E I O š ‚ Y8$ c O I ý O – : × CI u ý ý · a| v O I '1" 'PDBM