9 results on '"Dong, H.J."'
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2. Room-temperature direct bonding of ZrO2 ceramic and SiCP/Al composite using ultrasonic waves
3. Grain morphology and mechanical strength of high-melting-temperature intermetallic joints formed in asymmetrical Ni/Sn/Cu system using transient liquid phase soldering process
4. Study on Mechanical Response Model of Soft Tissue in the Clamping Process
5. Influence of Ni particle addition on grain refinement of Cu-Sn intermetallic compound joints bonded at various temperatures
6. Homogeneous (Cu, Ni)6Sn5 intermetallic compound joints rapidly formed in asymmetrical Ni/Sn/Cu system using ultrasound-induced transient liquid phase soldering process
7. Distinct phenotypes distinguish the molecular classes of Angelman syndrome
8. Rapid formation of Ni3Sn4 joints for die attachment of SiC-based high temperature power devices using ultrasound-induced transient liquid phase bonding process
9. Study on the microstructure and mechanical properties of Cu-Sn intermetallic joints rapidly formed by ultrasonic-assisted transient liquid phase soldering
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