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Abstract: Si3N4 ceramic was self-jointed using a filler alloy of Cu–Pd–Ti, and the microstructure of the joint was analyzed. By using a filler alloy of Cu76.5Pd8.5Ti15 (at.%), a high quality Si3N4/Si3N4 joint was obtained by brazing at 1100–1200°C for 30min under a pressure of 2×10−3 MPa. The microstructure of the Si3N4/Si3N4 joint which was observed by EPMA, XRD and TEM, and the results indicated that a reaction layer of TiN existed at the interface between Si3N4 ceramic and filler alloy. The center of the joint was Cu base solid solution containing Pd, and some reaction phases of TiN, PdTiSi and Pd2Si found in the Cu [Pd] solid solution. [Copyright &y& Elsevier]