Search

Array jet impingement cooling is a significant technology of enhanced heat dissipation which is fit for high heat flux flow with large area. It is gradually applied to the cooling of electronic devices. However, The research on the nozzle array mode and the uniformity of the cooling surface still has deficiencies. Therefore, the influence of heat flux, inlet temperature, jet height, array mode, and diversion structure on jet impingement cooling performance and temperature distribution uniformity is analyzed through numerical calculation. The results show that the heat transfer coefficient of jet impingement cooling increases linearly with the increment of heat flux and inlet temperature. With the increment of the ratio of jet height to nozzle diameter (H/d), the heat transfer coefficient increases first and then decreases, that is, there is an optimal H/d, which makes the heat transfer performance of the array jet impact cooling best. The temperature uniformity of array jet impact cooling is greatly affected by array mode. The improvement effect of nozzle array mode on temperature uniformity is ranked as sequential >staggered >shield >elliptical array. The overall temperature uniformity and heat transfer coefficient are increased by 5.88% and 7.29% compared with the elliptical array. The heat transfer performance can be further improved by adding a flow channel to the in-line array layout, in which the heat transfer coefficient is increased by 6.53% and the overall temperature uniformity is increased by 1.45%. [ABSTRACT FROM AUTHOR]

In this study, a closed-loop spray cooling system using R134a as the working fluid was established. The heat transfer characteristics and influencing mechanism of transient spray cooling were studied. The transient spray cooling curve under quenching was built accurately. The results show that the vapor film suppressed time, tsup, is the main period that the spray cooling must pass through. The flow rate and the sub-cooling of R134a have little effect on the cooling rate but the critical heat flux, which are mainly affected by chamber pressure. The transient Jacob number decreases with the increases of chamber pressure. As Jacob number decreases, the growth of vapor film is inhibited, then the tsup reduces in consequence. The surface temperature drop point and critical heat flux increases with the rise of chamber pressure. The maximum critical heat flux is 70.08 W/cm² in this experiment. [ABSTRACT FROM AUTHOR]