Search

Temperature and strain are two vital parameters that play a significant role in wound diagnosis and healing. As periodic temperature measurements with a custom thermometer or strain measurements with conventional metallic gauges became less feasible for the modern competent health monitoring, individual temperature and strain measurement modalities incorporated into wearables and patches were developed. The proposed research in the article shows the development of a single sensor solution which can simultaneously measure both the above mentioned parameters. This work integrates a thermoelectric principle based temperature measurement approach into wearables, ensuring flexibility and bendability properties without affecting its thermo-generated voltage. The modified thermoelectric material helped to achieve stretchability of the sensor, thanks to its superior mechano-transduction properties. Moreover, the stretch-induced resistance changes become an additional marker for strain measurements so that both the parameters can be measured with the same sensor. Due to the independent measurement parameters (open circuit voltage and sensor resistance), the sensing model is greatly attractive for measurements without cross-sensitivity. The highly resilient temperature and strain sensor show excellent linearity, repeatability and good sensitivity. Besides, due to the compatibility of the fabrication scheme to low-temperature processing of the flexible materials and to mass volume production, printed fabrication methodologies were adopted to realize the sensor. This promises low-cost production and a disposable nature (single use) of the sensor patch. For the first time, this innovative temperature-strain dual parameter sensor concept has been tested on mice wounds in vivo. The preliminary experiments on mice wounds offer prospects for developing smart, i.e. sensorized, wound dressings for clinical applications., (© 2022. The Author(s).) more...

The field of printed electronics is rapidly evolving, producing low cost applications with enhanced performances with transparent, stretchable properties and higher reliability. Due to the versatility of printed electronics, industry can consider the implementation of electronics in a way which was never possible before. However, a post-processing step to achieve conductive structures-known as sintering-limits the production ease and speed of printed electronics. This study addresses the issues related to fast sintering without scarifying important properties such as conductivity and surface roughness. A drop-on-demand inkjet printer is employed to deposit silver nanoparticle-based inks. The post-processing time of these inks is reduced by replacing the conventional oven sintering procedure with the state-of-the-art method, named near-infrared sintering. By doing so, the post-processing time shortens from 30-60 min to 6-8 s. Furthermore, the maximum substrate temperature during sintering is reduced from 200 °C to 120 °C. Based on the results of this study, one can conclude that near-infrared sintering is a ready-to-industrialize post-processing method for the production of printed electronics, capable of sintering inks at high speed, low temperature and with low complexity. Furthermore, it becomes clear that ink optimization plays an important role in processing inkjet printable inks, especially after being near-infrared sintered. more...