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The Institute for Astronomy and Astrophysics in Tubingen (IAAT) has a long-term experience in developing and building space-qualified imaging and photon counting microchannel-plate (MCP) detectors, which are sensitive in the ultraviolet wavelength range. Our goal is to achieve high quantum efficiency and spatial resolution, while maintaining solar blindness and low-noise characteristics. Our flexible detector design is currently tailored to the specific needs of three missions: For the ESBO DS (European Stratospheric Balloon Observatory – Design Study) we provide a sealed detector to the STUDIO instrument (Stratospheric Ultraviolet Demonstrator of an Imaging Observatory), a 50 cm telescope with a UV imager for operation at an altitude of 37-41 km. In collaboration with the Indian Institute of Astrophysics we plan a space mission with a CubeSat-sized farultraviolet spectroscopic imaging instrument, featuring an open version of our detector. A Chinese mission, led by the Purple Mountain Observatory, comprises a multi-channel imager using open and sealed detector versions. Our MCP detector has a cesium activated p-doped gallium-nitride photocathode. Other photocathode materials like cesium-telluride or potassium-bromide could be used as an alternative. For the sealed version, the photocathode is operated in semi-transparent mode on a MgF2 window with a cut-off wavelength of about 118 nm. For missions requiring sensitivity below this cut-off, we are planning an open version. We employ a coplanar cross-strip anode and advanced low-power readout electronics with a 128-channel charge-amplifier chip. This publication focuses on the progress concerning the main development challenges: the optimization of the photocathode parameters and the sophisticated detector electronics.

A Cu-Sn-Ti-based active brazing filler alloy was in situ reinforced with nanosized TiC particles by adding different amounts of a cellulose nitride-based binder. The TiC particles emanate from a reaction of the Ti within the filler alloy with the carbon from the binder that does not decompose completely during heating. The correlation between the microstructure and mechanical performance was studied. In addition, the effect of different binder amounts on the shear strength and cutting performance of brazed diamond grains was studied in shear tests and single grain cutting tests. The results clearly show that the mechanical performance of the brazed diamond grains can be improved by the formation of TiC particles. This is attributed to particle strengthening of the filler alloy matrix as well as to the decreasing grain size and more homogeneous distribution of the (Cu,Sn)3Ti5 phase with increasing amount of binder.

We are developing imaging and photon counting UV-MCP detectors, which are sensitive in the wavelength range from far ultraviolet to near ultraviolet. A good quantum efficiency, solar blindness and high spatial resolution is the aim of our development. The sealed detector has a Cs-activated photoactive layer of GaN (or similarly advanced photocathode), which is operated in semitransparent mode on (001)-MgF 2 . The detector comprises a stack of two long-life MCPs and a coplanar cross strip anode with advanced readout electronics. The main challenge is the flawless growth of the GaN photocathode layer as well as the requirements for the sealing of the detector, to prevent a degradation of the photocathode. We present here the detector concept and the experimental setup, examine in detail the status in the production and describe the current status of the readout electronics development.

We describe the fabrication of thermoelectric modules based on Half-Heusler TiNiSn and FeNbSb and their performance assessment under different boundary conditions. Module design is guided by a multiphysics model implementing experimentally determined thermoelectric materials properties. We consider two types of boundary conditions: first, imposing fixed cold- and hot-side temperatures onto the module, and second, imposing fixed values for the heat transfer coefficients between module and heat sink and source, representative for a waste-heat-recovery system using the exhaust heat of an internal combustion engine. We compare the modeling results with experimental data obtained from Half-Heusler modules integrated into a heat exchanger mounted to the exhaust of a compact van.

In this work, Al2O3–Al2O3 and Al2O3–Ti solder joints intended for space applications were realized by applying metallic multilayers both on Ti and on polycrystalline Al2O3 substrates to ensure wetting during the soldering process. The eutectic Au-12Ge (wt%) alloy with a melting point of 361°C was used as solder material and two different multilayer systems on the ceramic (Cr-Ni/Ti-W/Au,Ti/Pt/Au) were investigated. The influence of different thermal pretreatments of the Al2O3 plates on the multilayer properties, the interface reactions during soldering and the mechanical properties were studied using Glow-Discharge Optical Emission Spectroscopy (GDOES), X-ray Photoelectron Spectroscopy (XPS), Scanning Electron Microscopy (SEM) and a shear test device. It is shown that joints with a good quality can be produced at a soldering temperature of 400°C, whereas their properties and fracture behavior are strongly dependent on the metallization layer properties and the thermal pretreatments.

Au-Ge based alloys are interesting as novel high temperature lead free solder alloys because of their low melting point, good thermal and electrical conductivity and high corrosion resistance. In the present work, the wetting and soldering behaviour of the eutectic Au-28 at.% Ge alloy on Cu and Ni substrates have been investigated. A good wetting on both substrates with final contact angles of 13-14° was observed. In addition, under controlled conditions good solder joints could be produced. Cu substrates exhibit a pronounced dissolution into the Au-Ge filler metal. This was referred to the formation of a reaction layer at the interface with a fcc structure, which allows fast diffusion of Cu and Au. On Ni substrates, the NiGe intermetallic compound was formed at the filler /substrate interface which prevents dissolution of Ni into the solder. Using thin filler metal foils (25 µm), a complete consumption of Ge in the reaction at the Ni interface was observed, leading to the formation of almost pure Au layer in the soldering zone.

The commercial active brazing alloy “Incusil-ABA” was used for the bonding of diamond grits in order to assess their suitability for high performance machining tools. It was found that the microstructure of the brazing alloy matrix consisted of primary precipitates of Cu in a Ag–Cu eutectic matrix and an additional Cu–In–Ti rich intermetallic phase. Interface characterisation revealed the presence of a Ti-rich interfacial layer between the diamond and the alloy matrix. Therefore, good wettability was obtained for the embedded diamond grit particles. This intervening layer comprised nanosized cuboidal TiC which seemed to have acted as a precursor to its formation and fine metastable needles that were identified as cubic Ti3InC. Furthermore it was demonstrated that a three phase crystallographic orientation relationship had been obeyed at the interfacial region between the diamond, TiC and Ti3InC.

Observations of ultraviolet light is the key to understand high temperature processes in the universe like hot plasma, accretion processes or illuminated protoplanetary discs around UV sources. Furthermore these observation contribute to major cosmological questions, like the distribution of baryonic matter or the formation of the milky way, as pointed out by Gomez de Castro et al.1 Driven by the idea to participate in the Russian World Space Observatory we started to develop a position sensitive micro channel plate detector (MCP) for spectroscopy in the range of 160nm to 300 nm. Although we are not part of this project we still build a MCP detector prototype. In this paper we will present the general design of the detector and mainly focus on the aspect of our photocathode, while the electronics will be explained in more detail in the paper Characterisation of low power readout electronics for a UV microchannel plate detector with cross-strip readout" (Paper number 9144-116) by Marc Pfeifer.

The World Space Observatory Ultraviolet (WSO-UV) is a multinational mission under the leadership of Russia with contributions of Spain and Germany. The mission is part of the Spektrum series and launch is currently scheduled for 2016. It consists of a 1.7m mirror focusing on spectrographs in the range of 102-310 nm withh a resolution of R ≥ 55,000 for high resolution spectral observations, a long-slit-spectrograph for spatially resolved observations and an imager. According to the Phase-B-Study all spectrographs will use the same detectors built by the IAAT. These spectrographs are designed to observe cosmic plasma with temperatures of several ten thousands Kelvin and atomic transition lines of all important atoms and molecuules like H2, CO, OH eetc. In knowledge about the formation of galaxies and analyze the atmospheres of extrasolar planets and protoplanetary discs. To achieve these goals the IAAT designed in cooperation with the Leibniz-Institute for Analytical Sciences (ISAS Berlin) the spectrographs. In addition Tubingen develops and builds a new type of michrchannel plate detector based on gallim nitride cathods and a cross-strip-anode.

The spectrographs of WSO-UV cover the wavelength range of 102 - 310 nm. The essential requirements for the associated detectors are high quantum effciency, solar blindness, and single photon detection. To achieve this, we develop a microchannel plate detector in a sealed tube. We plan to use cesium activated gallium nitride as semitransparent photocathode, a stack of two microchannel plates and a cross strip anode with advanced readout electronics. Challenges are the degradation of the photocathode under atmospheric conditions and the sealing process. We present the detector concept, details of the transfer and sealing processes under UHV, and the current status.

The joining of macroscopic films of vertically aligned multiwalled carbon nanotubes (CNTs) to titanium substrates is demonstrated by active vacuum brazing at 820 °C with a Ag–Cu–Ti alloy and at 880 °C with a Cu–Sn–Ti–Zr alloy. The brazing methodology was elaborated in order to enable the production of highly electrically and thermally conductive CNT/metal substrate contacts. The interfacial electrical resistances of the joints were measured to be as low as 0.35 Ω. The improved interfacial transport properties in the brazed films lead to superior electron fieldemission properties when compared to the as-grown films. An emission current of 150 μA was drawn from the brazed nanotubes at an applied electric field of 0.6 V μm−1. The improvement in electron field-emission is mainly attributed to the reduction of the contact resistance between the nanotubes and the substrate. The joints have high re-melting temperatures up to the solidus temperatures of the alloys; far greater than what is achievable with standard solders, thus expanding the application potential of CNT films to high-current and high-power applications where substantial frictional or resistive heating is expected