1. Experimental and modeling study of the thermal conductivity of SiCp/Al composites with bimodal size distribution
- Author
-
Hong Guo, Hui Chen, Xuebing Liang, Ke Chu, Fazhang Yin, Chengchang Jia, and Xuanhui Qu
- Subjects
Materials science ,Mechanical Engineering ,chemistry.chemical_element ,Thermal conductivity ,Volume (thermodynamics) ,chemistry ,Mechanics of Materials ,Aluminium ,Volume fraction ,Thermal ,Interfacial thermal resistance ,General Materials Science ,Composite material ,Porosity ,Electrical conductor - Abstract
The thermal conductivity of SiCp/Al composites with high volume fractions of 46 to 68% has been investigated. The composites were fabricated by pressureless infiltrating liquid aluminum into SiC preforms with monomodal and bimodal size distributions. The density measurement indicates that a small amount of pores is presented for the composites approaching their maximum volume fractions. An analytical model with an explicit expression is proposed for describing the thermal conductive behavior of the composites with multimodal-reinforced mixtures in terms of an effective medium approach taking into account the porosity effect. Predictions of the developed effective medium expression reveal good correspondence with the experimental results, and explore how each of the considered factors (i.e., particle size ratio, volume fraction ratio, and porosity) can have a significant effect on the thermal conductivity of the composites with bimodal mixtures.
- Published
- 2009