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Subwavelength-scale nanorods were implemented on the hexagonal pyramid of photochemically etched light-emitting diodes (LEDs) to improve light extraction efficiency (LEE). Sequential processes of Ag deposition and inductively coupled plasma etching successfully produce nanorods on both locally unetched flat surface and sidewall of hexagonal pyramids. The subwavelength-scale structures on flat surface offer gradually changed refractive index, and the structures on side wall of hexagonal pyramid reduce backward reflection, thereby enhancing further enhancement of the light extraction efficiency. Consequently, the nanorods implemented LED shows a remarkable enhancement in the light output power by 14% compared with that of the photochemically etched LEDs which is known to exhibit the highest light output power. Theoretical calculations using a rigorous coupled wave analysis method reveal that the subwavelength-scale nanorods are very effective in the elimination of TIR as well as backward reflections, thereby further enhancing LEE of the LEDs.

We present the enhancement of wall-plug efficiency in vertical InGaN/GaN light-emitting diodes (V-LEDs) by improved current spreading with a novel Al2O3 current blocking layer (CBL). The Al2O3 CBL deposited by electron-beam evaporation shows high transmittance and good corrosion resistance to acidic solutions. V-LEDs with an Al2O3 CBL show similar light output power but lower forward voltage as compared to those with a SiO2 CBL deposited by plasma-enhanced chemical vapor deposition. As a result, the wall-plug efficiency of V-LEDs with an Al2O3 CBL at 500 mA was improved by 5% as compared to those with a SiO2 CBL, and by 19% as compared to those without a CBL.

In this study, the role of anions in Au complexes was investigated as a dopant for graphene. Au(OH)3, Au2S, AuBr3, and AuCl3 were used as dopants. The average sheet resistance of the graphene decreased from 950 Ω sq−1 to 820, 600, 530, and 300 Ω sq−1 and the work function increased from 4.3 eV to 4.6, 4.8, 5.0 and 4.9 eV with Au(OH)3, Au2S, AuBr3, and AuCl3 dopants, respectively. However, thermal annealing of graphene increased the sheet resistance and decreased the work function. Furthermore, the G and 2D bands in the Raman spectra were recovered and the Au3+ peak in the Au 4f spectra decreased after thermal annealing, indicating the aggregation of metal particles. These results suggested that the degree of doping was related to the electronegativity of the anion in the Au complex and degradation of graphene was related to the bond strength between the Au cation and the counter anion. Therefore, anions with a high electronegativity and high bond strength are adequate for use as a p-type dopant in graphene.

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We investigate the effect of W diffusion barrier in Ti/W/Al ohmic contacts formed on N-face n-GaN. The contacts exhibit contact resistivity of as low as 2.3 × 10−4 Ω cm2 and better thermal stability than Ti/Al contacts. Cross-sectional transmission electron microscopy micrographs reveal that in-diffused Al atoms on the n-GaN surface react with N atoms to form an AlN layer in Ti/Al contacts, resulting in upward band bending, and consequently, a high contact resistivity. The use of a 10-nm-thick W layer suppresses the in-diffusion of Al atoms to n-GaN, thereby preventing the formation of AlN and enhancing the thermal stability of Ti/W/Al contacts.