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This research investigates the effects of pack cementation parameters on the thermodynamics, growth kinetics, and microstructure of the simple and silicon‐modified aluminide coatings on the IN718 superalloy. The growth kinetic modelling of the aluminide coating, activated by NH4Cl, is established as h=174252.02T12WAl12WNH4Cl12t12exp-8306.5T ${h={{174252.02}\over{{T}^{{{1}\over{2}}}}}{W}_{Al}^{{{1}\over{2}}}{W}_{NH4Cl}^{{{1}\over{2}}}{t}^{{{1}\over{2}}}exp\left({{-8306.5}\over{T}}\right)}$. further optimizing the kinetics modelling that includes both CaCl2 activator or the mixture of CaCl2 and NH4Cl. The results showed that NH4Cl as an activator generated a higher equilibrium partial pressure of halides, which enhanced the deposition efficiency of active Al atoms and facilitated the significant precipitation of Cr‐rich carbides. Additionally, part of the CaCl2 substitute NH4Cl could maintain a high coating growth rate and reduce the hazards. Adding Si element preferentially combines with Cr formed the Cr9.1Si0.9 phase along grain boundaries, which blocked the inner‐diffusion channels of Al atoms and reduced the thickness of the silicon‐modified aluminide coating compared to simple aluminide coating. These researches revealed the relationship among the thermodynamics, growth kinetics, and microstructure of simple and silicon‐modified aluminide coatings. The thickness and microstructure of coatings can be effectively regulated by adjusting the powder composition, content, and process parameters to achieve precise control. [ABSTRACT FROM AUTHOR]

• A silicate thermal insulation coating was prepared using water glass, etc. • The properties and structures of the coating were analyzed by various methods. • The coating formed a Si-O three-dimensional network structure at high temperatures. • The optimal preparation parameters and thermal insulation efficiency were determined. Thermal insulation slurry was fabricated using sodium silicate water glass (SSWG) as the film-forming material and hollow glass microspheres (HGM) as thermal insulation fillers. The thermal insulation slurry was coated on 316L stainless steel to fabricate a silicate thermal insulation coating. The results show that SiO 2 phase is formed by SSWG in the thermal insulation coating after sintering at 680 ℃. Through polymerization and dehydration reactions between Si-OH groups, the Si-O three-dimensional network structure develops at 680 ℃. The optimal value of SSWG to aggregate mass ratios is 2.00. Under this condition, the silicate thermal insulation coating exhibits smooth surface, continuous and dense microstructure, high Shore hardness of 50.1 HSD, remarkable thermal insulation efficiency of 21 % at 260 ℃, and excellent resistance to drop and thermal shock tests without any noticeable cracks or detachment. [ABSTRACT FROM AUTHOR]

Copper-graphite composites find extensive application as electrical contact materials. However, their tribological properties are limited by the weak interfacial bonding. In this study, Ti 3 AlC 2 was used to modify copper-graphite composites fabricated by vacuum sintering. The incorporation of Ti 3 AlC 2 included both coated Cu and uncoated Cu. The hardness, relative density, tribological properties, and microstructure of the composites were thoroughly investigated. The results show that the addition of Ti 3 AlC 2 coated with Cu was conducive to avoiding the agglomeration of Ti 3 AlC 2 particles, and resulting in superior relative density, hardness, lubrication and wear resistance of the composites. Furthermore, the incorporation of Ti 3 AlC 2 not only enhanced the presence of lubricating components in copper-graphite composites but also improved the interface bonding strength between the copper matrix and graphite. Specifically, Cu-graphite-Ti 3 AlC 2 (Cu-coated) composites displayed a relative density of 92%, a hardness of 94.2 HV, a friction coefficient of 0.175, and a wear rate of 1.28 × 10−6 mm3/N·m. • Graphite and Ti 3 AlC 2 were used to synergistically reinforce copper matrix composites. • The microstructure and properties of Cu-graphite-Ti 3 AlC 2 composites were investigated. • The interfacial bonding between copper and graphite was improved. [ABSTRACT FROM AUTHOR]

• TiC particles in the composites were synthesized by in-situ decomposition of Ti 3 AlC 2. • The interfacial bond strength between the copper matrix and graphite was strengthened through the presence of a TiC layer. • Copper-graphite-TiC composites were analyzed by XRD, SEM and EDS. Copper-graphite-TiC composites were prepared by gas pressure sintering, using copper-coated graphite, pure copper, and Ti 3 AlC 2 as the raw materials. The phase composition and microstructure of copper-graphite-TiC composites have been studied. The results indicate that a strong interdiffusion occurred between the copper matrix and Ti 3 AlC 2 during the sintering process. Ti 3 AlC 2 was completely decomposed into TiC, and a TiC interface transition layer was formed to enhance the bonding strength between the copper matrix and graphite. [ABSTRACT FROM AUTHOR]

Copper/graphite/Ti 2 SnC composites were prepared using spark plasma sintering with copper-coated graphite powder, Ti 2 SnC powder, and copper powder as raw materials. The effect of sintering temperatures (800, 850, 900, and 950 °C) on the microstructure, relative density, hardness, resistivity, and tribological properties of the composites was studied in this paper. The results show that Cu and Ti 2 SnC demonstrate obvious inter-diffusion during sintering and become stronger with an increase in the sintering temperature, and the phase change process of the Cu matrix was in the order: Cu → Cu 5.6 Sn → Cu 41 Sn 11 → Cu 3 Sn. The relative density, hardness, friction coefficient, and the wear rate of the composites were the best when the sintering temperature was 900 °C, and their values were 97.21%, 67.68 HSD, 0.25, and 3.72 × 10−6 mm3/(N·m), respectively, whereas the resistivity of the composites was the best when the sintering temperature was 950 °C, and it was 6.116 × 10−7 Ω m. • Copper/Graphite/Ti 2 SnC composites were prepared by spark plasma sintering. • The composites samples were sintered at different temperatures (800, 850, 900, 950 °C). • The tribological properties, hardness, and resistivity of the composites samples were investigated. • The composites samples were analyzed by XRD, SEM, and EDS. [ABSTRACT FROM AUTHOR]

A new mercapto-terminated binuclear Cu(II) complex, [Cu 2 Cl 2 (mtboc) 2 (C 12 H 8 N 2 ) 2 ] [mtboc =2-(methylthio)benzo[ d ]oxazole-5-carboxylic acid] (Cu2), was synthesized and characterized by single-crystal X-ray diffraction studies. The Cu2 complex was then immobilized on the surface of Au electrodes through S Au bonds to form a self-assembled monolayer. The electrochemical properties of the as-prepared Cu2- modified Au electrode (Au/Cu2) were investigated using cyclic voltammetry, electrochemical impedance spectroscopy, and differential pulse voltammetry (DPV). Moreover, as a biomimetic sensor for the determination of dopamine (DA) and uric acid (UA), the Au/Cu2 electrode exhibited excellent electrocatalytic activity for the oxidation of DA with a faster electron-transfer rate (6.61 s −1 ). The DPV technique was used for the trace determination of DA. The dependence of current vs. concentration was linear from 0.2 to 30 μM with a regression coefficient of 0.9975, and the detection limit of DA was ∼ 0.08 μM. Furthermore, the modified electrode clearly separated the DA signal from the interference effect of UA, thus realizing the simultaneous detection of DA and UA. Finally, the method was applied to the selective and precise analysis of DA in commercial injection and urine samples. [ABSTRACT FROM AUTHOR]