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2. Formation of octahedral corrosion products in Sn–Ag flip chip solder bump.

Author

Kang, Hanbyul, Lee, Miji, Sun, Dongyoon, Pae, Sangwoo, and Park, Jongwoo

Subjects
*FLIP chip technology, *CORROSION & anti-corrosives, *SOLDER & soldering, *DENDRITIC crystals, *DISTILLED water
Abstract

We investigated the corrosion behavior of the Sn–2.3 wt.%Ag flip-chip solder bump in distilled water. At the early stage, dendritic corrosion products were converted into pyramidal shapes. The six pyramids grew simultaneously during a prolonged corrosion process. Finally, the octahedral corrosion products are formed. The octahedral corrosion product consisted of Sn and O, and was a mixture of amorphous and nanocrystalline SnO 2 phase. The mechanism of this corrosion product was essentially a galvanic cell reaction. [ABSTRACT FROM AUTHOR]

Published
2015
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